公开(公告)号：US20240132646A1

公开(公告)日：2024-04-25

申请号：US18546197

申请日：2022-02-17

申请人： Resonac Corporation

发明人： Naoki FURUKAWA ,  Yuki NAKAMURA ,  Nozomi MATSUBARA ,  Hiroshi YOKOTA

IPC分类号： C08F222/38 ,  C08K3/22

CPC分类号： C08F222/38 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/001

摘要： A composition containing a compound represented by the following Formula (1):




[in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain]; and



a compound represented by the following Formula (2):








[in the Formula (2), R21 and R22 each independently represent a hydrogen atom or a monovalent organic group, and R21 and R22 may be bonded to each other to form a ring; and R23 represents a hydrogen atom or a methyl group].

公开(公告)号：US20240047230A1

公开(公告)日：2024-02-08

申请号：US18258454

申请日：2021-12-20

申请人： Resonac Corporation

发明人： Tomoko HIGASHIUCHI ,  Hiroshi YOKOTA ,  Tomohiko KOTAKE ,  Naoki FURUKAWA ,  Naoki MARUYAMA ,  Yutaka OKADA ,  Nozomi MATSUBARA

IPC分类号： H01L21/56 ,  H01L23/00

CPC分类号： H01L21/566 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2924/1435

摘要： A method for manufacturing a semiconductor device, the method including: a step of disposing an adhesive thermal insulation material on a semiconductor device; a step of performing reflow of the semiconductor device having the thermal insulation material disposed thereon; and a step of detaching the thermal insulation material from the semiconductor device.

公开(公告)号：US20240043597A1

公开(公告)日：2024-02-08

申请号：US18258467

申请日：2021-12-20

申请人： Resonac Corporation

发明人： Tomoko HIGASHIUCHI ,  Hiroshi YOKOTA ,  Naoki FURUKAWA ,  Nozomi MATSUBARA

IPC分类号： C08F265/08 ,  C08J5/18 ,  C08L55/02

CPC分类号： C08F265/08 ,  C08J5/18 ,  C08L55/02 ,  C08F222/1063

摘要： A composition containing first hollow particles being thermally expandable hollow particles; second hollow particles being hollow particles other than the first hollow particles; and a polymerizable compound.

公开(公告)号：US20240043648A1

公开(公告)日：2024-02-08

申请号：US18258492

申请日：2021-12-20

申请人： Resonac Corporation

发明人： Tomoko HIGASHIUCHI ,  Hiroshi YOKOTA ,  Naoki FURUKAWA ,  Nozomi MATSUBARA

IPC分类号： C08J9/224 ,  C08F222/10 ,  C08F299/02

CPC分类号： C08J9/224 ,  C08F222/10 ,  C08F299/02 ,  C08J5/18

摘要： A composition containing a compound represented by the following Formula (1):




[in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain.]; and hollow particles.