公开(公告)号：US11894325B2

公开(公告)日：2024-02-06

申请号：US17294066

申请日：2019-11-13

申请人： ROHM CO., LTD.

发明人： Manato Kurata

IPC分类号： H01L23/00

CPC分类号： H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L2224/02331 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05557 ,  H01L2224/05647 ,  H01L2224/13017 ,  H01L2224/1357 ,  H01L2224/13147 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/73104

摘要： A semiconductor device includes a semiconductor layer that has a main surface, an electrode pad that is formed on the main surface, a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being formed on the main surface such as to be drawn out to a region outside the electrode pad, and a resin that covers the second wiring surface on the main surface and that seals the rewiring.