公开(公告)号：US20140291828A1

公开(公告)日：2014-10-02

申请号：US14226280

申请日：2014-03-26

Applicant: ROHM CO., LTD.

Inventor： Koji YASUNAGA ,  Shingo TAKAKI

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49541 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/04034 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37005 ,  H01L2224/37012 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40106 ,  H01L2224/40245 ,  H01L2224/40496 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/84047 ,  H01L2224/84801 ,  H01L2224/92246 ,  H01L2924/181 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor device includes: a semiconductor element having an electrode facing a first direction; a first lead having a conductive distal end surface facing the electrode, and a rising portion which is connected to the distal end surface to extend away from the electrode; a conductive bonding material bonding the electrode of the semiconductor element to the distal end surface of the first lead; and a sealing resin covering the semiconductor element, at least a portion of the first lead, and the conductive bonding material

Abstract translation: 半导体器件包括：具有面向第一方向的电极的半导体元件; 具有面向电极的导电性远端面的第一引线和与远端面连接以远离电极延伸的上升部; 将所述半导体元件的电极与所述第一引线的前端面接合的导电性接合材料; 以及覆盖半导体元件的密封树脂，第一引线的至少一部分和导电接合材料