Real-time individual electronic enclosure cooling system
    1.
    发明授权
    Real-time individual electronic enclosure cooling system 有权
    实时个人电子机柜冷却系统

    公开(公告)号:US09476649B2

    公开(公告)日:2016-10-25

    申请号:US14513188

    申请日:2014-10-13

    CPC classification number: F28D5/00 H05K7/2079 H05K7/20827 H05K7/20836

    Abstract: This discloses apparatuses for cooling individual server racks or electrical enclosures. These devices maintain target enclosure temperatures within plus or minus 1 or 2 degrees F. The devices employ industrial cooling using staged cooling towers to evaporatively reach temperatures below the wet bulb temperature of the ambient air. Methods for using such apparatuses are disclosed as well.

    Abstract translation: 这公开了用于冷却各个服务器机架或电气外壳的装置。 这些设备将目标机柜的温度保持在正或负1或2华氏度。设备采用工业冷却,使用分级冷却塔来蒸发地达到低于环境空气湿球温度的温度。 也公开了使用这种装置的方法。

    Real time individual electronic enclosure cooling system
    2.
    发明授权
    Real time individual electronic enclosure cooling system 有权
    实时个人电子机柜冷却系统

    公开(公告)号:US08857204B2

    公开(公告)日:2014-10-14

    申请号:US13748088

    申请日:2013-01-23

    Abstract: A computer server enclosure (such as in a server farm) evaporative cooling system. The system includes multiple cooling towers and includes cooling coil heat transfer equipment locally associated with a server enclosure or group of server enclosures, with the system subject to command and control equipment.

    Abstract translation: 计算机服务器机箱(如服务器场)蒸发冷却系统。 该系统包括多个冷却塔,并且包括本地与服务器机箱或服务器机箱组相关联的冷却盘管传热设备,系统受命令和控制设备的管理。

    REAL TIME INDIVIDUAL ELECTRONIC ENCLOSURE COOLING SYSTEM
    3.
    发明申请
    REAL TIME INDIVIDUAL ELECTRONIC ENCLOSURE COOLING SYSTEM 有权
    实时独立电子外壳冷却系统

    公开(公告)号:US20130133350A1

    公开(公告)日:2013-05-30

    申请号:US13748088

    申请日:2013-01-23

    Abstract: This discloses apparatuses for cooling individual server racks or electrical enclosures. These devices maintain target enclosure temperatures within plus or minus 1 or 2 degrees F. The devices employ industrial cooling using staged cooling towers to evaporatively reach temperatures below the wet bulb temperature of the ambient air. Methods for using such apparatuses are disclosed as well.

    Abstract translation: 这公开了用于冷却各个服务器机架或电气外壳的装置。 这些设备将目标机柜的温度保持在正或负1或2华氏度。设备采用工业冷却,使用分级冷却塔来蒸发地达到低于环境空气湿球温度的温度。 也公开了使用这种装置的方法。

    Real-Time Individual Electronic Enclosure Cooling System
    6.
    发明申请
    Real-Time Individual Electronic Enclosure Cooling System 审中-公开
    实时个人电子外壳冷却系统

    公开(公告)号:US20150153109A1

    公开(公告)日:2015-06-04

    申请号:US14513188

    申请日:2014-10-13

    CPC classification number: F28D5/00 H05K7/2079 H05K7/20827 H05K7/20836

    Abstract: This discloses apparatuses for cooling individual server racks or electrical enclosures. These devices maintain target enclosure temperatures within plus or minus 1 or 2 degrees F. The devices employ industrial cooling using staged cooling towers to evaporatively reach temperatures below the wet bulb temperature of the ambient air. Methods for using such apparatuses are disclosed as well.

    Abstract translation: 这公开了用于冷却各个服务器机架或电气外壳的装置。 这些设备将目标机柜的温度保持在正或负1或2华氏度。设备采用工业冷却,使用分级冷却塔来蒸发地达到低于环境空气湿球温度的温度。 也公开了使用这种装置的方法。

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