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公开(公告)号:US12077646B2
公开(公告)日:2024-09-03
申请号:US17380931
申请日:2021-07-20
发明人: Sung-Chan Jo , Kyonghoon Lee , John S. Althaus , Hyung Jin Park
CPC分类号: C08J7/06 , C23C16/02 , C23C16/56 , C08J2379/00
摘要: This application features a method of forming a polymer layer on the surface of a substrate using a self-initiating monomer. A polymer layer is formed by polymerization of a monomer on a metal layer to fill or cover defects of the metal layer. The metal layer the polymer layer may be used as an airtight material.