公开(公告)号：US10148227B2

公开(公告)日：2018-12-04

申请号：US15490969

申请日：2017-04-19

Applicant: Qorvo US, Inc.

Inventor： Dirk Robert Walter Leipold ,  Baker Scott ,  George Maxim ,  David Reed

IPC: H03F1/02 ,  H03F3/19 ,  H03F3/21

Abstract: Circuitry that includes a radio frequency (RF) power amplifier (PA) and a dynamic supply boosting circuit, is disclosed. The RF PA receives and amplifies an RF input signal to provide an RF transmit signal using a PA power supply voltage. The dynamic supply boosting circuit provides the PA power supply voltage using a dynamic supply input voltage, wherein when a peak-to-average (PAR) of the RF input signal exceeds a PAR threshold, the dynamic supply boosting circuit boosts the PA power supply voltage, such that the PA power supply voltage is greater than the dynamic supply input voltage.

公开(公告)号：US10447222B2

公开(公告)日：2019-10-15

申请号：US15921843

申请日：2018-03-15

Applicant: Qorvo US, Inc.

Inventor： Baker Scott ,  David Reed ,  Christopher T. Brown ,  Dirk Robert Walter Leipold ,  George Maxim

IPC: H04L1/24 ,  H03G3/20 ,  H03G3/00 ,  H03F1/30 ,  H03F1/02 ,  H03F1/32 ,  H03F3/195 ,  H03F3/24

Abstract: Dynamic error vector magnitude (EVM) compensation is accomplished for radio frequency (RF) power amplifiers (PAs) which experience EVM distortion from thermal settling. Thermal settling causes gain changes in the PAs, and systems, apparatuses, and methods of the present disclosure compensate for known thermal transients of PAs.

公开(公告)号：US20190074806A1

公开(公告)日：2019-03-07

申请号：US15921843

申请日：2018-03-15

Applicant: Qorvo US, Inc.

Inventor： Baker Scott ,  David Reed ,  Christopher T. Brown ,  Dirk Robert Walter Leipold ,  George Maxim

IPC: H03G3/20 ,  H03G3/00 ,  H04L1/24 ,  H03F1/30

CPC classification number: H03G3/20 ,  H03F1/0266 ,  H03F1/30 ,  H03F1/3241 ,  H03F3/195 ,  H03F3/245 ,  H03F2200/411 ,  H03F2200/447 ,  H03G3/004 ,  H03G3/3042 ,  H03G2201/708 ,  H04L1/24

Abstract: Dynamic error vector magnitude (EVM) compensation is accomplished for radio frequency (RF) power amplifiers (PAs) which experience EVM distortion from thermal settling. Thermal settling causes gain changes in the PAs, and systems, apparatuses, and methods of the present disclosure compensate for known thermal transients of PAs.

公开(公告)号：US20180241350A1

公开(公告)日：2018-08-23

申请号：US15490969

申请日：2017-04-19

Applicant: Qorvo US, Inc.

Inventor： Dirk Robert Walter Leipold ,  Baker Scott ,  George Maxim ,  David Reed

IPC: H03F1/02 ,  H03F3/19 ,  H03F3/21

CPC classification number: H03F1/0216 ,  H03F1/56 ,  H03F3/19 ,  H03F3/245 ,  H03F2200/102 ,  H03F2200/222 ,  H03F2200/387 ,  H03F2200/408 ,  H03F2200/411 ,  H03F2200/451

Abstract: Circuitry that includes a radio frequency (RF) power amplifier (PA) and a dynamic supply boosting circuit, is disclosed. The RF PA receives and amplifies an RF input signal to provide an RF transmit signal using a PA power supply voltage. The dynamic supply boosting circuit provides the PA power supply voltage using a dynamic supply input voltage, wherein when a peak-to-average (PAR) of the RF input signal exceeds a PAR threshold, the dynamic supply boosting circuit boosts the PA power supply voltage, such that the PA power supply voltage is greater than the dynamic supply input voltage.