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公开(公告)号：US08838064B2
公开(公告)日：2014-09-16
申请号：US13680419
申请日：2012-11-19
Applicant: QUALCOMM Incorporated
Inventor： Kirk S. Taylor , Liren Chen , Jack B. Steenstra , Guilherme K. Hoefel , Yang Zhang , Zhiheng Mao , Santosh Gopalan
Abstract: Implementations relate to systems and methods for localized notification that provide localized information to one or more mobile devices in a wireless communication system that are located in one or more geographical regions. The wireless communication system includes a localized notification server that responds to geographically-targeted broadcast requests and localized service or information requests. The localized notification server localizes components of the wireless communication system into sets of localized components that provide wireless communication service to mobile devices in the specific geographical regions.In response to a request to broadcast to a target geographical region, the localized notification server identifies a set of localized components associated with the target geographical region. The localized notification server then broadcasts information to mobile devices actively serviced by the set of localized components.
Abstract translation: 实现涉及用于向位于一个或多个地理区域中的无线通信系统中的一个或多个移动设备提供本地化信息的本地化通知的系统和方法。 无线通信系统包括本地化的通知服务器，其响应地理位置的广播请求和本地化的服务或信息请求。 本地化通知服务器将无线通信系统的组件本地化为向特定地理区域中的移动设备提供无线通信服务的本地化组件集合。 响应于向目标地理区域广播的请求，本地化通知服务器识别与目标地理区域相关联的一组本地化组件。 然后，本地化通知服务器将信息广播到由该组本地化组件主动服务的移动设备。
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Patent Agency Ranking
公开(公告)号：US20130079034A1
公开(公告)日：2013-03-28
申请号：US13680419
申请日：2012-11-19
Applicant: QUALCOMM Incorporated
Inventor： Kirk S. Taylor , Liren Chen , Jack B. Steenstra , Guilherme K. Hoefel , Yang Zhang , Zhiheng Mao , Santosh Gopalan
IPC: H04W4/02
Abstract: Implementations relate to systems and methods for localized notification that provide localized information to one or more mobile devices in a wireless communication system that are located in one or more geographical regions. The wireless communication system includes a localized notification server that responds to geographically-targeted broadcast requests and localized service or information requests. The localized notification server localizes components of the wireless communication system into sets of localized components that provide wireless communication service to mobile devices in the specific geographical regions.In response to a request to broadcast to a target geographical region, the localized notification server identifies a set of localized components associated with the target geographical region. The localized notification server then broadcasts information to mobile devices actively serviced by the set of localized components.
Abstract translation: 实现涉及用于向位于一个或多个地理区域中的无线通信系统中的一个或多个移动设备提供本地化信息的本地化通知的系统和方法。 无线通信系统包括本地化的通知服务器，其响应地理位置的广播请求和本地化的服务或信息请求。 本地化通知服务器将无线通信系统的组件本地化为向特定地理区域中的移动设备提供无线通信服务的本地化组件集合。 响应于向目标地理区域广播的请求，本地化通知服务器识别与目标地理区域相关联的一组本地化组件。 然后，本地化通知服务器将信息广播到由该组本地化组件主动服务的移动设备。
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公开(公告)号：US09232640B2
公开(公告)日：2016-01-05
申请号：US13792092
申请日：2013-03-10
Applicant: QUALCOMM Incorporated
Inventor： Yang Zhang , Jack B. Steenstra
CPC classification number: H05K1/0298 , H05K1/0201 , H05K7/02 , H05K2201/09663 , H05K2201/09709 , H05K2201/09972 , H05K2201/10098 , H05K2201/10151 , Y10T29/49124 , Y10T29/4913
Abstract: A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.
Abstract translation: 提供了一种用于减少由手持设备或非手持设备内的电路产生的热量的影响的印刷电路板组件。 印刷电路板组件可以包括印刷电路板，其包括多个导电层和多个电介质层，其中每个电介质层设置在一对导电层之间。 每个导电层可以包括由交替导电层中的间隙不对准的间隙分开的第一部分和第二部分。 每个导电层的第一部分可以与每个导电层的第二部分基本上热隔离。
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公开(公告)号：US20140364152A1
公开(公告)日：2014-12-11
申请号：US14465276
申请日：2014-08-21
Applicant: QUALCOMM Incorporated
Inventor： Kirk Taylor , Liren Chen , Jack Steenstra , Guilherme Hoefel , Yang Zhang , Zhiheng Mao , Santosh Gopalan
IPC: H04W4/02
CPC classification number: H04W68/005 , H04L67/18 , H04W4/021
Abstract: Implementations relate to systems and methods for localized notification that provide localized information to one or more mobile devices in a wireless communication system that are located in one or more geographical regions. The wireless communication system includes a localized notification server that responds to geographically-targeted broadcast requests and localized service or information requests. The localized notification server localizes components of the wireless communication system into sets of localized components that provide wireless communication service to mobile devices in the specific geographical regions.In response to a request to broadcast to a target geographical region, the localized notification server identifies a set of localized components associated with the target geographical region. The localized notification server then broadcasts information to mobile devices actively serviced by the set of localized components.
Abstract translation: 实现涉及用于向位于一个或多个地理区域中的无线通信系统中的一个或多个移动设备提供本地化信息的本地化通知的系统和方法。 无线通信系统包括本地化的通知服务器，其响应地理位置的广播请求和本地化的服务或信息请求。 本地化通知服务器将无线通信系统的组件本地化为向特定地理区域中的移动设备提供无线通信服务的本地化组件集合。 响应于向目标地理区域广播的请求，本地化通知服务器识别与目标地理区域相关联的一组本地化组件。 然后，本地化通知服务器将信息广播到由该组本地化组件主动服务的移动设备。
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公开(公告)号：US20140160699A1
公开(公告)日：2014-06-12
申请号：US14038633
申请日：2013-09-26
Applicant: QUALCOMM Incorporated
Inventor： Yang Zhang , Jack Brian Steenstra
CPC classification number: H05K13/00 , H01L23/552 , H01L2924/0002 , H05K1/0218 , H05K3/284 , H05K9/0024 , H05K2201/0715 , H05K2203/0169 , H05K2203/1316 , H01L2924/00
Abstract: Methods and apparatus for providing conformal shielding are disclosed to provide electromagnetic interference shielding of circuit components mounted on a circuit board. A print mold stencil is provided with one or more conductive shielding walls disposed within the stencil before its application to the circuit board and detachable therefrom, and also configured to encompass the circuit components. In this manner a shielded compartment volume is defined by walls of the print mold stencil and one or more of the conductive shielding walls, and may be easily and quickly applied to the circuit board to encompass the components for shielding. A conformal shielding layer is then formed from a molding material disposed in the shielded compartment volume that encompasses the components, as well as a conductive layer disposed on the outer surface of the material, and coupling of the shielding walls with a ground plane in the circuit board.
Abstract translation: 公开了用于提供共形屏蔽的方法和装置，以提供安装在电路板上的电路部件的电磁干扰屏蔽。 印刷模具模板在其施加到电路板之前设置有设置在模板内的一个或多个导电屏蔽壁，并且可以从电路板拆卸，并且还构造成包围电路部件。 以这种方式，屏蔽隔室体积由印刷模版模具的壁和一个或多个导电屏蔽壁限定，并且可以容易且快速地施加到电路板以包围用于屏蔽的部件。 然后，从设置在包围部件的屏蔽室体积中的模制材料以及设置在材料的外表面上的导电层以及屏蔽层与电路中的接地平面的耦合形成保形屏蔽层 板。
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公开(公告)号：US10091918B2
公开(公告)日：2018-10-02
申请号：US14038633
申请日：2013-09-26
Applicant: QUALCOMM Incorporated
Inventor： Yang Zhang , Jack Brian Steenstra
IPC: H05K13/00 , H01L23/552 , H05K1/02 , H05K9/00 , H05K3/28
Abstract: Methods and apparatus for providing conformal shielding are disclosed to provide electromagnetic interference shielding of circuit components mounted on a circuit board. A print mold stencil is provided with one or more conductive shielding walls disposed within the stencil before its application to the circuit board and detachable therefrom, and also configured to encompass the circuit components. In this manner a shielded compartment volume is defined by walls of the print mold stencil and one or more of the conductive shielding walls, and may be easily and quickly applied to the circuit board to encompass the components for shielding. A conformal shielding layer is then formed from a molding material disposed in the shielded compartment volume that encompasses the components, as well as a conductive layer disposed on the outer surface of the material, and coupling of the shielding walls with a ground plane in the circuit board.
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