公开(公告)号：US11626336B2

公开(公告)日：2023-04-11

申请号：US16590299

申请日：2019-10-01

Applicant: QUALCOMM Incorporated

Inventor： Daniel Garcia ,  Kinfegebriel Amera Mengistie ,  Francesco Carrara ,  Chang-Ho Lee ,  Ashish Alawani ,  Mark Kuhlman ,  John Jong-Hoon Lee ,  Jeongkeun Kim ,  Xiaoju Yu ,  Supatta Niramarnkarn

IPC: H01L23/16 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/00

Abstract: A package that includes a substrate having a first surface; a solder resist layer coupled to the first surface of the substrate; a device located over the solder resist layer such that a portion of the device touches the solder resist layer; and an encapsulation layer located over the solder resist layer such that the encapsulation layer encapsulates the device. The solder resist layer is configured as a seating plane for the device. The device is located over the solder resist layer such that a surface of the device facing the substrate is approximately parallel to the first surface of the substrate. The solder resist layer includes at least one notch. The device is located over the solder resist layer such that at least one corner of the device touches the at least one notch.

公开(公告)号：US10693432B2

公开(公告)日：2020-06-23

申请号：US15982655

申请日：2018-05-17

Applicant: QUALCOMM Incorporated

Inventor： Nosun Park ,  Changhan Hobie Yun ,  Jonghae Kim ,  Niranjan Sunil Mudakatte ,  Xiaoju Yu ,  Wei-Chuan Chen

IPC: H03H7/01 ,  H01F27/40 ,  H01L21/56 ,  H01L21/683 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L25/16 ,  H01L27/01 ,  H01L49/02 ,  H03H1/00 ,  H03H3/00

Abstract: A three-dimensional (3D) solenoid structure includes a first inductor portion having a first surface and a second surface opposite the first surface. The 3D solenoid structure further includes a first capacitor portion, a first inductor pillar, at least one capacitor pillar, a second inductor portion, a second inductor pillar and a first inductor bonding interface. The first inductor pillar is coupled to the first surface of the first inductor portion. The capacitor pillar(s) is coupled to the first capacitor portion. The second inductor portion includes a first surface and a second surface opposite the first surface. The second inductor pillar is coupled to the first surface of the second inductor portion. The first inductor bonding interface, between the first inductor pillar and the second inductor pillar, couples together the first inductor portion and the second inductor portion.

公开(公告)号：US11177065B2

公开(公告)日：2021-11-16

申请号：US16835227

申请日：2020-03-30

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Xiaoju Yu ,  Xia Li ,  Bin Yang

IPC: H01L23/498 ,  H01F27/22 ,  H01G4/33 ,  H01F27/29 ,  H01G4/252

Abstract: Examples herein include thermally conductive pathways for glass substrates such as used by passive on glass devices that may be used to enhance the thermal conductivity of an integrated POG device. By using a thermally conductive material for passivation of the device pathways during manufacturing, the device pathways may be able to conduct heat away from the device. For example, by using a selected poly (p-phenylene benzobisoxazole) (PBO) based material (e.g., poly-p-phenylene-2, 6-benzobisoxazole) instead of conventional polyimide (PI) materials during a Cu pattern passivation process, the overall thermal performance of the device, may be enhanced.

公开(公告)号：US10582609B2

公开(公告)日：2020-03-03

申请号：US15798071

申请日：2017-10-30

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  Jonghae Kim ,  Xiaoju Yu ,  Mario Francisco Velez ,  Wei-Chuan Chen ,  Niranjan Sunil Mudakatte ,  Matthew Michael Nowak ,  Christian Hoffmann ,  Rodrigo Pacher Fernandes ,  Manuel Hofer ,  Peter Bainschab ,  Edgar Schmidhammer ,  Stefan Leopold Hatzl

IPC: H05K1/02 ,  H05K3/32 ,  H03H9/02 ,  H03H9/10 ,  H03H3/02 ,  H03H9/05 ,  H03H3/08

Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.

公开(公告)号：US10292269B1

公开(公告)日：2019-05-14

申请号：US15950865

申请日：2018-04-11

Applicant: QUALCOMM Incorporated

Inventor： Niranjan Sunil Mudakatte ,  Changhan Hobie Yun ,  Jonghae Kim ,  Xiaoju Yu ,  Nosun Park ,  Mario Francisco Velez

IPC: H05K1/16 ,  H05K1/18 ,  H01L23/522 ,  H03H7/01 ,  H01L23/66 ,  H01L49/02

Abstract: An inductor-capacitor (LC) filter includes an inductor having an asymmetric shape including at least one turn. The LC filter also includes serial capacitors coupled to the inductor at only one end of a continuous portion of the inductor. The serial capacitors continues the shape of the inductor. The capacitors are outside of a footprint of the continuous portion of the inductor.