公开(公告)号：US20250090030A1

公开(公告)日：2025-03-20

申请号：US18470755

申请日：2023-09-20

Applicant: QUALCOMM Incorporated

Inventor： Hrishikesh Vijaykumar PANCHAWAGH ,  Sumit AGRAWAL ,  Bernard HERRERA SOUKUP ,  Camilo PEREZ SAAIBI ,  Legardo REYES ,  Ila BADGE ,  Michelle Ma Thin Thin Htay CHAN ,  Chin-Jen TSENG ,  Ali LOPEZ ,  Nicholas BUCHAN ,  Kostadin Dimitrov DJORDJEV ,  John Keith SCHNEIDER

IPC: A61B5/00 ,  A61B5/02 ,  A61B5/021

Abstract: Some disclosed examples pertain to an apparatus that can include a platen, a light source system, a receiver system, and an electromagnetic interference (EMI) shield. The light source system can include light source system circuitry, a light-emitting component, and a light guide component having a substantially uniform cross-section. The light-emitting component provides light to an area of the platen via the light guide component. The receiver system can include at least two receiver stack portions residing proximate on either side of the light guide component. The receiver system detects acoustic waves corresponding to a photoacoustic response of a target object proximate the area of the platen, to light emitted by the light source system. The EMI shield shields the receiver system from at least some of the EMI produced by the light source system circuitry. The light guide component conveys light through a portion of the EMI shield.

公开(公告)号：US20210056276A1

公开(公告)日：2021-02-25

申请号：US16544681

申请日：2019-08-19

Applicant: QUALCOMM Incorporated

Inventor： Yipeng LU ,  Jessica Liu STROHMANN ,  Ila BADGE ,  Hrishikesh Vijaykumar PANCHAWAGH ,  Tsongming KAO

IPC: G06K9/00

Abstract: A device and method for improved sensing with a biometric sensor assembly such as an ultrasound fingerprint sensor using an anti-fingerprint, oleophobic, or hydrophobic coating applied to a surface above the biometric sensor assembly. The coating improves the mechanical coupling of a human finger to the surface, helping to reduce acoustic loss through the finger to surface interface, improving at least the false-rejection ratio.

公开(公告)号：US20240206736A1

公开(公告)日：2024-06-27

申请号：US18069859

申请日：2022-12-21

Applicant: QUALCOMM Incorporated

Inventor： Yipeng LU ,  Hrishikesh Vijaykumar PANCHAWAGH ,  Nicholas BUCHAN ,  Kostadin Dimitrov DJORDJEV ,  Camilo PEREZ SAAIBI ,  Legardo REYES ,  Ali LOPEZ ,  Ila BADGE ,  Chin-Jen Tseng ,  Ye ZHAN ,  John Keith Schneider

IPC: A61B5/00 ,  A61B5/021 ,  B06B1/06 ,  B06B3/00 ,  G01H11/08 ,  G10K11/02 ,  G10K11/162 ,  G10K11/30

CPC classification number: A61B5/0095 ,  A61B5/02125 ,  A61B5/6824 ,  A61B5/6826 ,  B06B1/0611 ,  B06B3/00 ,  G01H11/08 ,  G10K11/02 ,  G10K11/162 ,  G10K11/30 ,  B06B2201/76

Abstract: An apparatus may include a platen, a light source system and an ultrasonic receiver system. The light source system may be configured to provide light to a target object on an outer surface of the platen. The light source system may be configured to direct the light along a first axis oriented at a first angle relative to the outer surface of the platen. The ultrasonic receiver system may be configured to receive ultrasonic waves generated by the target object responsive to the light from the light source system. The ultrasonic receiver system may include one or more receiver elements residing in a receiver plane. A normal to the receiver plane being may be oriented along a second axis at a second angle relative to the outer surface of the platen. The first angle may be different from the second angle.

公开(公告)号：US20240424529A1

公开(公告)日：2024-12-26

申请号：US18339878

申请日：2023-06-22

Applicant: QUALCOMM Incorporated

Inventor： Chin-Jen TSENG ,  Jessica Liu STROHMANN ,  Ila BADGE ,  Michelle Ma Thin Thin Htay CHAN

IPC: B06B1/06 ,  G06V40/13

Abstract: An apparatus includes an ultrasonic sensor stack configured to transmit and receive ultrasonic waves. The ultrasonic sensor stack includes at least a thin film transistor layer, a piezoelectric layer, and a thin electrode layer. The ultrasonic sensor stack further includes a tunable metal layer coupled to the thin electrode layer and an acoustic layer coupled to the tunable metal layer, where the tunable metal layer has a thickness greater than a thickness of the thin electrode layer. The thickness of the tunable metal layer may be configured to match a peak frequency in an ultrasonic frequency range of the ultrasonic waves transmitted by the ultrasonic sensor stack. In some implementations, the tunable metal layer includes a copper layer and the acoustic layer includes polyimide or polyethylene terephthalate.

公开(公告)号：US20240210359A1

公开(公告)日：2024-06-27

申请号：US18069901

申请日：2022-12-21

Applicant: QUALCOMM Incorporated

Inventor： Sumit AGRAWAL ,  Ali LOPEZ ,  Hrishikesh Vijaykumar PANCHAWAGH ,  Kostadin Dimitrov DJORDJEV ,  Camilo PEREZ SAAIBI ,  Legardo REYES ,  Nicholas BUCHAN ,  Ila BADGE ,  Chin-Jen TSENG

IPC: G01N29/24 ,  G01N21/01 ,  G01N21/17 ,  G01N21/88 ,  G01N29/22

CPC classification number: G01N29/2418 ,  G01N21/01 ,  G01N21/1702 ,  G01N21/8806 ,  G01N29/223 ,  G01N2021/0106 ,  G01N2021/8845

Abstract: An apparatus may include a platen, a light source system and a receiver system. The light source system may at least a first light-emitting component and at least a first light guide component. The first light guide component may be configured to transmit light from the first light-emitting component towards a target object in contact with a first area of the platen. The receiver system may include at least two receiver stack portions. A first receiver stack portion may reside proximate a first side of a first portion of the first light guide component and a second receiver stack portion may reside proximate a second side of the first portion of the first light guide component. The receiver system may be configured to detect acoustic waves corresponding to a photoacoustic response of the target object to light emitted by the light source system.