公开(公告)号：US20150228712A1

公开(公告)日：2015-08-13

申请号：US14177072

申请日：2014-02-10

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie YUN ,  Daeik Daniel KIM ,  Chengjie ZUO ,  Jonghae KIM ,  Mario Francisco VELEZ ,  Donald William KIDWELL ,  Jon Bradley LASITER ,  Kwan-Yu LAI ,  Jitae KIM ,  Ravindra Vaman SHENOY

IPC: H01L49/02 ,  H01L23/48

CPC classification number: H01L28/90 ,  H01G4/012 ,  H01G4/33 ,  H01L21/28282 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5223 ,  H01L27/0805 ,  H01L27/12 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.

Abstract translation: 提供的空间效率电容器具有比传统设计更高的品质因数，并且改善了从直通玻璃通孔（TGV）到电介质的电能的耦合。 例如，提供了具有非矩形横截面的TGV，其中TGV的一端耦合到第一金属板。 在第一金属板上形成电介质材料。 第二金属板以与第一金属板的至少一部分重叠以形成电介质材料的至少一个重叠区域的方式形成在电介质材料上。 重叠区域的周边的至少一部分是非平面的。 重叠区域可以形成为环形的多个部分中的大致四分之一环形的闭环形状和/或大致一半的环形形状。

公开(公告)号：US20220279137A1

公开(公告)日：2022-09-01

申请号：US17188360

申请日：2021-03-01

Applicant: QUALCOMM Incorporated

Inventor： Jon LASITER ,  Ravindra Vaman SHENOY ,  Ravishankar SIVALINGAM ,  Russell GRUHLKE ,  Donald William KIDWELL ,  Khurshid Syed ALAM ,  Kebin LI

IPC: H04N5/33 ,  H01L27/146

Abstract: An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.

公开(公告)号：US20220030148A1

公开(公告)日：2022-01-27

申请号：US16937397

申请日：2020-07-23

Applicant: QUALCOMM Incorporated

Inventor： Russell GRUHLKE ,  Ravindra Vaman SHENOY ,  Jon LASITER ,  Donald William KIDWELL ,  Khurshid Syed ALAM ,  Kebin LI

IPC: H04N5/225 ,  G01J1/42 ,  G02B13/18

Abstract: An image sensor including a planar sensor array, a lens configured to form an optical image on the planar sensor array and characterized by a locus of focal points on a curved surface, and a cover glass with multiple thickness levels or multiple cover glasses of different sizes. The one or more cover glasses are configured to shift the locus of focal points for large field angles, such that there are multiple intersections between the planar sensor array and the locus of focal points for a large FOV, and thus multiple zones with best focus on the planar sensor array.