公开(公告)号：US20150220125A1

公开(公告)日：2015-08-06

申请号：US14690330

申请日：2015-04-17

Applicant: QUALCOMM INCORPORATED

Inventor： UNNIKRISHNAN VADAKKANMARUVEEDU ,  PARAS S. DOSHI ,  ANKUR JAIN ,  VINAY MITTER ,  RICHARD A. STEWART

IPC: G06F1/26 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/26 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  G06F2217/80 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for thermal energy management in a portable computing device (“PCD”) based on power level calculations are disclosed. An exemplary method includes tracking instantaneous operating temperatures and active power supply levels to one or more components. With an estimate or measurement of ambient temperature, the instantaneous operating temperature values and active power supply level values can be used to calculate an instantaneous thermal resistance value. In the event that thermal energy generation should be managed, a target operating temperature may be used with the ambient temperature and the instantaneous thermal resistance value to solve for an optimum power supply level. The active power supply level may then be adjusted based on the calculated optimum power supply level.

Abstract translation: 公开了基于功率电平计算的便携式计算设备（“PCD”）中用于热能管理的方法和系统的各种实施例。 示例性方法包括将瞬时操作温度和有功电力供应水平跟踪到一个或多个组件。 通过对环境温度的估计或测量，可以使用瞬时工作温度值和有功电源电平值来计算瞬时热阻值。 在管理热能产生的情况下，可以使用目标工作温度与环境温度和瞬时热阻值来求解最佳供电水平。 然后可以基于计算的最佳电源电平来调整有功电源电平。

公开(公告)号：US20150169016A1

公开(公告)日：2015-06-18

申请号：US14600667

申请日：2015-01-20

Applicant: QUALCOMM INCORPORATED

Inventor： PARAS S. DOSHI ,  ANKUR JAIN ,  UNNIKRISHNAN VADAKKANMARUVEEDU ,  VINJAY MITTER ,  ANIL VOOTUKURU ,  RONALD F. ALTON ,  JON J. ANDERSON

IPC: G06F1/20 ,  G06F11/30 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3287 ,  G06F1/3296 ,  G06F11/3031 ,  G06F11/3037 ,  G06F11/3058 ,  Y02D10/126 ,  Y02D10/172

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Abstract translation: 公开了在便携式计算设备（“PCD”）中实现的用于自适应热管理技术的方法和系统的各种实施例。 值得注意的是，在许多PCD中，与PCD中各种组件相关的温度阈值，例如但不限于芯片结温度，封装封装（“PoP”）存储器温度和器件外表面的“触摸温度” 本身限制了可以利用PCD的性能能力的程度。 对于自适应热管理的方法和系统的各种实施例的优点在于，当违反温度阈值时，PCD的性能只能在授权热攻击之前被尽可能多地牺牲，并且在必要时被清除， 处理组件返回到最大操作功率。