公开(公告)号：US08541870B1

公开(公告)日：2013-09-24

申请号：US13645289

申请日：2012-10-04

Applicant: Powertech Technology Inc.

Inventor： Wen-Jeng Fan ,  Che-Min Chu ,  Wei-Min Chen

IPC: H01L23/495

CPC classification number: H01L23/4951 ,  H01L23/49558 ,  H01L23/49575 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00

Abstract: Disclosed is a semiconductor package utilizing a tape to reinforce fixing of leads to a die pad having a through hole. The package primarily comprises a leadframe having the plurality of leads and the die pad, a tape, at least a chip, and an encapsulant. The die pad. The tape is attached beneath the leadframe adjacent to the inner fingers of the leads to fix the leads and the die pad for wire-bonding. Additionally, the tape does not completely cover the through hole. The chip is disposed on the leads and the die pad and electrically connected to the inner fingers. The encapsulant encapsulates the die pad, the tape and the chip with the leads being insulatedly bonded where the encapsulant further completely fills into the through hole through its opening without completely covered by the tape.

Abstract translation: 公开了一种利用带子来加强将引线固定到具有通孔的管芯焊盘的半导体封装。 封装主要包括具有多个引线和管芯焊盘的引线框，至少芯片和密封剂的带。 芯片垫 带子连接在引线框架的下方，与引线的内指相邻，以固定引线和芯片焊盘以进行引线接合。 此外，磁带不完全覆盖通孔。 芯片设置在引线和芯片焊盘上，并与内指电连接。 密封剂封装芯片焊盘，磁带和芯片，引线绝缘地结合在一起，其中密封剂通过其开口进一步完全填充到通孔中，而不完全被磁带覆盖。