公开(公告)号：US20170154705A1

公开(公告)日：2017-06-01

申请号：US15310152

申请日：2015-04-22

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuki KOTANI ,  Hiroyoshi YODEN

IPC: H01B3/40 ,  C09K5/14 ,  C08L63/00

CPC classification number: H01B3/40 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K9/08 ,  C08L63/00 ,  C08L101/00 ,  C08L2203/206 ,  C08L2205/03 ,  C08L2205/12 ,  C09K5/14 ,  H01B3/00

Abstract: An insulating thermally conductive resin composition (10) includes a matrix resin (1) and insulators (2). The insulators (2) are dispersed in the matrix resin and have electrical insulation. The insulating thermally conductive resin composition further includes a thermally conductive phase (3) which has a hither thermal conductivity than the matrix resin and thermally connects the insulators with each other. The thermally conductive phase (3) is composed of an organic substance. The thermally conductive phase that thermally connects the insulators is composed of the organic substance, so that the resultant insulating thermally conductive resin composition has electrical insulation while having improved thermal conductivity.

公开(公告)号：US20220239153A1

公开(公告)日：2022-07-28

申请号：US17613547

申请日：2020-05-15

Applicant: Panasonic Intellectual Property Management Co.,Ltd.

Inventor： Masahiro NAKAMURA ,  Shozo OSHIO ,  Yuki KOTANI

IPC: H02J50/10 ,  G02B26/00 ,  G02B5/20 ,  H01F7/08 ,  H01F7/14 ,  G05D16/20 ,  H01F7/02 ,  H02J50/40

Abstract: A structural body includes: a three-dimensional net shaped body including a plurality of net lines that form a three-dimensional net shape; and a plurality of objects respectively present in two or more of a plurality of spaces partitioned by the plurality of net lines. The plurality of objects are each a mobile object that moves within one of the plurality of spaces or moves over two or more of the plurality of spaces.

公开(公告)号：US20240301701A1

公开(公告)日：2024-09-12

申请号：US18273049

申请日：2022-01-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuki KOTANI ,  Shozo OSHIO ,  Masahiro NAKAMURA ,  Tetsushi KONDA

IPC: E04F13/08 ,  B32B3/06 ,  B32B7/022 ,  B32B7/06 ,  B32B27/08 ,  B32B27/36 ,  B32B27/40

CPC classification number: E04F13/0835 ,  B32B3/06 ,  B32B7/022 ,  B32B7/06 ,  B32B27/08 ,  B32B27/365 ,  B32B27/40 ,  E04F13/0866 ,  B32B2307/51 ,  B32B2307/7376 ,  B32B2419/00

Abstract: A connection structure includes: a first structure body and a second structure body which is detachably connected to the first structure body. The first structure body includes a first fitting portion, and the second structure body includes a second fitting portion which is detachably fitted with the first fitting portion. At least one of the first fitting portion or the second fitting portion is an anisotropic elastic structure body including a periodic structure and having an elasticity which differs depending on a direction. When a fitting direction in which the first fitting portion and the second fitting portion are fitted together is a first direction, and a direction which is orthogonal to the first direction is a second direction, the anisotropic elastic structure body has an elasticity which is greater in the second direction than in the first direction.

公开(公告)号：US20160178186A1

公开(公告)日：2016-06-23

申请号：US14893146

申请日：2014-05-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomokazu KUSUNOKI ,  Hiroyoshi YODEN ,  Yuki KOTANI ,  Ryusuke KOTERA

IPC: F21V29/87 ,  F21V29/89 ,  H01L33/64 ,  H01L33/48 ,  H01L33/56 ,  F21K99/00 ,  F21V29/70

CPC classification number: F21V29/87 ,  F21K9/00 ,  F21K9/20 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21V29/85 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/56 ,  H01L33/644

Abstract: An LED unit (100) includes a base unit (1). The LED unit further includes a light emitting device (3) including: a package substrate (3b); and a light emitting portion (3a) provided in the package substrate and having LED chips, the light emitting device being placed on a front surface of the base unit. The base unit is formed of a molding in which a metal member (11) is covered with thermally conductive resin having an electrical insulation property, and the thermally conductive resin is interposed between the light emitting device and the metal member. The LED unit can thus efficiently radiate heat generated in the light emitting device through the base unit toward a fixture to which the LED unit is attached.

Abstract translation: LED单元（100）包括基座单元（1）。 LED单元还包括发光器件（3），包括：封装衬底（3b）; 以及设置在所述封装基板中并且具有LED芯片的发光部分（3a），所述发光器件被放置在所述基座单元的前表面上。 基体单元由金属构件（11）被具有电绝缘性的导热性树脂覆盖的成型体形成，并且导热性树脂介于发光元件与金属构件之间。 因此，LED单元可以有效地将发光装置中产生的热量通过基座单元朝向与LED单元相连的固定装置发射。