公开(公告)号：US09941167B2

公开(公告)日：2018-04-10

申请号：US15426199

申请日：2017-02-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Bunzi Mizuno ,  Shogo Okita ,  Mitsuru Hiroshima ,  Tutomu Sakurai ,  Noriyuki Matsubara

IPC: H01L21/00 ,  H01L21/78 ,  H01L21/67 ,  H01L21/683 ,  H01L21/268 ,  H01L21/3065

CPC classification number: H01L21/78 ,  H01J2237/334 ,  H01L21/268 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/31116 ,  H01L21/67069 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6831

Abstract: The method includes a laser scribing step of forming an opening including an exposing portion, where the first layer is exposed, by irradiating the dividing region of the substrate with laser light from the first main surface side, forming a remaining region on which the second layer in the dividing region remains around the opening other than the exposing portion, and forming a first damaged region of a surface layer portion of the first layer including the exposing portion and a second damaged region of a surface layer portion of the first layer to be covered by the remaining region on the first layer of the dividing region.