公开(公告)号：US20190272952A1

公开(公告)日：2019-09-05

申请号：US16344355

申请日：2017-11-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuji YASUOKA ,  Tomohiro FUJITA ,  Takeyuki FUJII ,  Toru INOUE ,  Chikara NARA ,  Makoto ITOU

IPC: H01F41/06 ,  H01F17/04 ,  H01F27/29 ,  H01F41/02

Abstract: A magnetic core includes a winding core and first and second flanges connected to the winding core. First and second terminal electrodes are connected to a lead frame. The first flange is bonded to the first and second terminal electrodes. Third and fourth terminal electrodes are bonded to the second flange. First and second insulation-coated conductive wires are wound about the winding core. The first and second insulation-coated conductive wires are connected to the first and second terminal electrodes and the third and fourth terminal electrodes. The lead frame is bent so as to rotate the magnetic core by 90 degrees with respect to the lead frame. A magnetic plate is bonded to the magnetic core. The magnetic core is removed from the lead frame by removing the first and second terminal electrodes from the lead frame, thereby providing a common-mode choke coil. The common-mode choke coil having stable electrical performance is produced efficiently by the above method.

公开(公告)号：US20240355512A1

公开(公告)日：2024-10-24

申请号：US18684148

申请日：2022-08-10

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuki AOIKE ,  Hirokatsu ITO ,  Kenichi MATSUSHIMA ,  Shogo NAKAYAMA ,  Tomohiro FUJITA ,  Takashi OHBAYASHI

IPC: H01C7/06 ,  H01C17/00 ,  H01C17/065

CPC classification number: H01C7/06 ,  H01C17/006 ,  H01C17/06526 ,  H01C17/06546 ,  H01C17/06586

Abstract: A resistive paste according to the present disclosure includes metal particles, insulating particles, glass particles, and a metal silicide. The metal particles include copper and nickel. The insulating particles include at least one of alumina, zirconia, zinc oxide, or boron nitride. A chip resistor according to the present disclosure includes a resistive element and a substrate. The resistive element includes the resistive paste as a material and is disposed on the substrate.