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公开(公告)号:US20240355512A1
公开(公告)日:2024-10-24
申请号:US18684148
申请日:2022-08-10
Inventor: Yuki AOIKE , Hirokatsu ITO , Kenichi MATSUSHIMA , Shogo NAKAYAMA , Tomohiro FUJITA , Takashi OHBAYASHI
IPC: H01C7/06 , H01C17/00 , H01C17/065
CPC classification number: H01C7/06 , H01C17/006 , H01C17/06526 , H01C17/06546 , H01C17/06586
Abstract: A resistive paste according to the present disclosure includes metal particles, insulating particles, glass particles, and a metal silicide. The metal particles include copper and nickel. The insulating particles include at least one of alumina, zirconia, zinc oxide, or boron nitride. A chip resistor according to the present disclosure includes a resistive element and a substrate. The resistive element includes the resistive paste as a material and is disposed on the substrate.
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公开(公告)号:US20240161948A1
公开(公告)日:2024-05-16
申请号:US18255989
申请日:2021-12-06
Inventor: Takashi OHBAYASHI , Junko ONOZAKI , Hirokatsu ITO , Kyousuke ISONO
IPC: H01C1/02 , C09D7/40 , C09D7/61 , C09D7/65 , C09D163/04
CPC classification number: H01C1/02 , C09D7/61 , C09D7/65 , C09D7/69 , C09D163/04
Abstract: A chip resistor includes: a resistor body; and a protective coating that covers the resistor body. The protective coating is a cured product of a coating agent containing a polyfunctional epoxy resin, a curing agent, an inorganic filler, and silicone rubber particles. The coating agent contains: silica as the inorganic filler at a content equal to or greater than 60% by weight and equal to or less than 90% by weight; and the silicone rubber particles at a content equal to or greater than 1% by weight and equal to or less than 15% by weight.
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