公开(公告)号：US20230158606A1

公开(公告)日：2023-05-25

申请号：US18158457

申请日：2023-01-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JINGBO WANG ,  TSUTOMU SUGIYAMA ,  SHUNSUKE KAWAI ,  KENZO SHIBATA ,  MASASHI ISHIGURO ,  ATSUHIRO KAWAMOTO

IPC: B23K26/21 ,  B23K26/082 ,  B23K26/08

CPC classification number: B23K26/21 ,  B23K26/082 ,  B23K26/0884

Abstract: Provided is a laser welding method including a welding step of welding a workpiece by irradiating a surface of a workpiece with a laser beam that is swept two-dimensionally while being advanced in an X direction. In the welding step, the laser beam is swept to draw a predetermined pattern on the surface of the workpiece. Additionally, drawing speed and output of the laser beam are controlled to have an equal amount of heat input per unit drawing length in the predetermined pattern over the entire length of the predetermined pattern. The predetermined pattern is a continuous pattern in which two annular patterns are in contact with each other at one point.

公开(公告)号：US20230013501A1

公开(公告)日：2023-01-19

申请号：US17935111

申请日：2022-09-25

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JINGBO WANG ,  TSUTOMU SUGIYAMA ,  SHUNSUKE KAWAI ,  KENZO SHIBATA ,  MASASHI ISHIGURO

IPC: B23K26/21

Abstract: A laser welding method includes a welding step of applying a laser beam to a surface of a workpiece while the laser beam is caused to advance in an X-direction and scanning with the laser beam is simultaneously performed in a Y-direction intersecting the X-direction. The welding step includes a first weaving step of causing the laser beam to weave in the Y-direction with first amplitude (A1), and a second weaving step of causing the laser beam to weave with a predetermined amplitude smaller than first amplitude (A1) at both end portions of a weaving trajectory drawn by the laser beam in the first weaving step.

公开(公告)号：US20240082950A1

公开(公告)日：2024-03-14

申请号：US18513665

申请日：2023-11-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JIN MATSUZAKA ,  SHUNSUKE KAWAI ,  JINGBO WANG ,  KENZO SHIBATA

IPC: B23K26/064 ,  B23K26/03

CPC classification number: B23K26/064 ,  B23K26/032

Abstract: The laser processing device includes a laser head that emits laser light and a camera that acquires a surface image of a processing member after being irradiated with the laser light. The laser processing device further includes an image processor that performs image processing on an acquired surface image and calculates a diameter of a processing mark, and an autofocus controller that derives an optimum focal position of the laser light based on the diameter of the processing mark. In addition, the laser processing device includes a driver that moves the laser head in an emission direction of the laser light to allow the laser light to be condensed at an optimum focal position based on the derivation result of the autofocus controller.