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Patent Agency Ranking
公开(公告)号：US20200214167A1
公开(公告)日：2020-07-02
申请号：US16723526
申请日：2019-12-20
Inventor： Toshinobu HATANO , Makoto SAITO , Ken NAKAMURA
IPC: H05K7/20
Abstract: A heat dissipation structure of an electronic device, includes: a metal case; and a rigid flexible board housed in the metal case and comprising a rigid portion and a flex portion connected to the rigid portion. At least part of the flex portion contacts the metal case to allow heat generated by an electronic component mounted on the rigid portion to be released to the metal case.
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公开(公告)号：US20200271282A1
公开(公告)日：2020-08-27
申请号：US16063765
申请日：2016-11-10
Inventor： Takanori AKETA , Nobuyuki MIYAGAWA , Hironori KAMI , Makoto SAITO , Toshihiko SATO
Abstract: A light-emitting element includes: a phosphor layer including phosphor (phosphor particles) of at least one type; a substrate which has a thermal conductivity higher than a thermal conductivity of the phosphor layer, the substrate having a principal surface above which the phosphor layer is disposed; and a joining part which is interposed between the phosphor layer and the substrate to join the phosphor layer and the substrate together with metal. An adhesion layer and a reflecting layer are interposed between the joining part and the phosphor layer, the adhesion layer being light-transmissive and on a principal surface of the phosphor layer which faces the substrate, the reflecting layer being on a principal surface of the adhesion layer which faces the substrate.
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公开(公告)号：US20180166617A1
公开(公告)日：2018-06-14
申请号：US15573088
申请日：2016-04-26
Inventor： Mituhiko UEDA , Makoto SAITO , Takanori AKETA , Toru HIRANO
CPC classification number: H01L33/62 , H01L23/12 , H01L23/14 , H01L23/147 , H01L23/32 , H01L24/42 , H01L33/44 , H01L33/60 , H01L2224/14 , H01L2224/16145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.
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公开(公告)号：US20240107725A1
公开(公告)日：2024-03-28
申请号：US18526674
申请日：2023-12-01
Inventor： Yasutaka MATSUMOTO , Makoto SAITO , Yoshihisa SHIMAZU , Keiichi UJITA
CPC classification number: H05K9/0009 , H04N23/51 , H04N23/52
Abstract: An imaging device according to the present disclosure includes a front case, a rear case, and a shield member. The front case supports an imaging optical unit. The rear case includes an electrically conductive output mechanism configured to output a signal output from the imaging optical unit. The shield member electrically connects the front case and the output mechanism.
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公开(公告)号：US20220377950A1
公开(公告)日：2022-11-24
申请号：US17743981
申请日：2022-05-13
Inventor： Yasutaka MATSUMOTO , Makoto SAITO , Yoshihisa SHIMAZU , Keiichi UJITA
Abstract: An imaging device according to the present disclosure includes a front case, a rear case, and a shield member. The front case supports an imaging optical unit. The rear case includes an electrically conductive output mechanism configured to output a signal output from the imaging optical unit. The shield member electrically connects the front case and the output mechanism.
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