公开(公告)号：US10276423B2

公开(公告)日：2019-04-30

申请号：US15893999

申请日：2018-02-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shogo Okita ,  Koji Tamura ,  Akihiro Itou ,  Atsushi Harikai ,  Noriyuki Matsubara

IPC: H01L21/683 ,  H01L21/78 ,  H01L21/308 ,  H01L21/3065 ,  H01L23/00

Abstract: A method of manufacturing a semiconductor chip includes: preparing a semiconductor wafer; forming a mask on a front surface of the semiconductor wafer so as to cover each of the element regions and to expose the dividing region; exposing the front surface to plasma in a state where a back surface of the semiconductor wafer is held with a dicing tape to dice the semiconductor wafer into a plurality of semiconductor chips by etching the dividing region exposed from the mask up to the back surface while protecting each of the element regions with the mask from plasma; and removing the mask from the front surface together with an adhesive tape by peeling off the adhesive tape after sticking the adhesive tape to the side of the front surface.