公开(公告)号：US20150131030A1

公开(公告)日：2015-05-14

申请号：US14601703

申请日：2015-01-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tomohiro SEKIGUCHI ,  Kiyotaka NAKASE ,  Takayuki FURUKAWA

IPC: G02F1/1333 ,  G02F1/1335

CPC classification number: G02F1/133385 ,  G02F1/133382 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133314 ,  G02F2201/501 ,  H05K7/20963

Abstract: A display device includes: a display panel; a plurality of backlight units disposed on a rear side of the display panel; a first frame disposed on a rear side of the backlight units; a heat transfer sheet disposed on a rear side of the first frame above a predetermined position; and a second frame disposed on a rear side of the heat transfer sheet. An air layer is formed between the first frame and the second frame, below the heat transfer sheet.

Abstract translation: 显示装置包括：显示面板; 布置在所述显示面板的后侧的多个背光单元; 设置在所述背光单元的后侧的第一框架; 设置在所述第一框架的背面上方的规定位置的传热片材; 以及设置在传热片的后侧的第二框架。 在第一框架和第二框架之间，在传热片材的下面形成空气层。

公开(公告)号：US20150124161A1

公开(公告)日：2015-05-07

申请号：US14594888

申请日：2015-01-12

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Noburo CHIKADA ,  Kiyotaka NAKASE ,  Makoto IYODA

IPC: H04N5/225

CPC classification number: H04N5/2252 ,  G03B17/02 ,  H04N5/2253

Abstract: An imaging device according to the present disclosure includes: an imaging unit that is housed in an outer case and captures an image of an object; a circuit board that is disposed on a back side in the outer case and includes a semiconductor device mounted thereon for processing a signal from the imaging unit; and a metal plate that is disposed between the imaging unit and the circuit board in the outer case and is fixed to the outer case. The metal plate has a first portion opposite to the circuit board and brought into mechanical contact with the semiconductor device through a contact member, and at least two second portions formed integrally with the first portion and bent in an optical axis direction of the imaging unit.

Abstract translation: 根据本公开的成像装置包括：成像单元，其容纳在外壳中并且捕获物体的图像; 电路板，设置在外壳的背侧，并且包括安装在其上的半导体器件，用于处理来自成像单元的信号; 以及金属板，其设置在所述外壳中的所述摄像单元和所述电路基板之间并且固定到所述外壳。 金属板具有与电路板相对的第一部分，并且通过接触构件与半导体器件机械接触，并且至少两个第二部分与第一部分整体形成并沿着成像单元的光轴方向弯曲。