公开(公告)号：US20220030707A1

公开(公告)日：2022-01-27

申请号：US17357159

申请日：2021-06-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NORIMICHI NOGUCHI ,  MASATERU MIKAMI ,  KENJI TOYOSHIMA ,  HIROKI ODA ,  DAISUKE SUETSUGU ,  TATSUYA URAKAWA

IPC: H05K1/03 ,  H01C1/14 ,  H01C7/18 ,  H01C17/00 ,  H05K1/16 ,  B32B18/00 ,  C04B35/624 ,  C04B35/44

Abstract: A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.