公开(公告)号：US20240405042A1

公开(公告)日：2024-12-05

申请号：US18204959

申请日：2023-06-02

Applicant: PixArt Imaging Inc.

Inventor： Jen-Chuan Chen ,  Chi-Chih Shen ,  Hsuan-Yao Chang ,  Yu-Chiao Peng

IPC: H01L27/146 ,  H01L31/18

Abstract: An optical detection module and a related manufacturing method are applied for chip scale package technology. The optical detection module includes a chip scale package assembly and a light sheltering layer. The chip scale package assembly includes a glass substrate, a detection chip, an isolation layer, a plurality of redistribution layers, and a plurality of conductive contacts. The detection chip is located above the glass substrate. The isolation layer is disposed on a surface of the detection chip opposite to the glass substrate. The plurality of redistribution layers is disposed on the isolation layer and spaced from each other, and having a plurality of conductive units. The plurality of conductive contacts is respectively disposed on the plurality of conductive units. The light sheltering layer is disposed on a lateral surface of the chip scale package assembly, and adapted to block light transmission and provide a covering protection function.

公开(公告)号：US20170115159A1

公开(公告)日：2017-04-27

申请号：US15093751

申请日：2016-04-08

Applicant: PixArt Imaging Inc.

Inventor： Chi-Chih Shen ,  Hung-Ching Lai

IPC: G01J1/02

CPC classification number: G01J1/0214 ,  G01J1/0271 ,  G01J1/0488 ,  G01J2001/0276

Abstract: An optical detecting device capable of preventing environmental pollution includes a casing, an optical detecting component and a transparent component. The casing includes a light through unit and at least one accommodating structure. The optical detecting component is disposed inside the accommodating structure. The transparent component is disposed inside the accommodating structure and located above the optical detecting component, to partly fill the accommodating structure at least and block between the light through unit and the optical detecting component.

公开(公告)号：US10527488B2

公开(公告)日：2020-01-07

申请号：US15173698

申请日：2016-06-05

Applicant: PixArt Imaging Inc.

Inventor： Chi-Chih Shen

IPC: H01J40/14 ,  G01J1/02 ,  G01L19/00

Abstract: An optical detecting device has gas emission and pressure reduction function and includes a holder, a light penetrating component, a light detecting component, a hole structure, and a. The light penetrating component is disposed on the holder to form an accommodating space whereinside the light detecting component is disposed. The hole structure is formed on the holder to connect with the accommodating space. The waterproofing and ventilating component is disposed on the holder and covers the hole structure to prevent liquid from leaking into the accommodating space via the hole structure. While an inner gas pressure of the accommodating space is decreased, part of the gas is exhausted from the accommodating space via the hole structure and the waterproofing and ventilating component.

公开(公告)号：US10439077B2

公开(公告)日：2019-10-08

申请号：US15979708

申请日：2018-05-15

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0232 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/0216 ,  H01L31/09 ,  H01L31/024

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US10378952B2

公开(公告)日：2019-08-13

申请号：US15093751

申请日：2016-04-08

Applicant: PixArt Imaging Inc.

Inventor： Chi-Chih Shen ,  Hung-Ching Lai

IPC: G01J1/02 ,  G01J1/04

Abstract: An optical detecting device capable of preventing environmental pollution includes a casing, an optical detecting component and a transparent component. The casing includes a light through unit and at least one accommodating structure. The optical detecting component is disposed inside the accommodating structure. The transparent component is disposed inside the accommodating structure and located above the optical detecting component, to partly fill the accommodating structure at least and block between the light through unit and the optical detecting component.

公开(公告)号：US09778101B2

公开(公告)日：2017-10-03

申请号：US14983489

申请日：2015-12-29

Applicant: PixArt Imaging Inc.

Inventor： Cheng-Lin Yang ,  Hung-Ching Lai ,  Chi-Chih Shen

IPC: G01J1/04 ,  G01J1/42 ,  G06F3/03 ,  G01J1/02

CPC classification number: G01J1/0422 ,  G01J1/0204 ,  G01J1/42 ,  G01J2001/4242 ,  G06F3/0304 ,  G06F3/0317

Abstract: An optical detecting module includes a housing, a light emitting component, an optical detecting component and an optical signal collecting component. The light emitting component is disposed inside the housing. The optical detecting component is disposed inside the housing to receive an optical detecting signal generated by the light emitting component. The optical signal collecting component is utilized to hold the light emitting component for signal collection. The optical signal collecting component includes an output portion, a bottom portion and at least one lateral portion. The light emitting component is disposed on the bottom portion, and an optical positive signal of the optical detecting signal is projected out of the housing through the output portion. The lateral portion is bent from the bottom portion to reflect an optical lateral signal of the optical detecting signal, and the optical lateral signal is projected out of the housing through the output portion.

公开(公告)号：US12040416B2

公开(公告)日：2024-07-16

申请号：US17955854

申请日：2022-09-29

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0203 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/0216 ,  H01L31/024 ,  H01L31/09

CPC classification number: H01L31/0203 ,  G01J5/00 ,  G01J5/0025 ,  G01J5/045 ,  G01J5/20 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/02363 ,  G01J2005/206 ,  H01L27/14601 ,  H01L31/02164 ,  H01L31/024 ,  H01L31/095

Abstract: An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

公开(公告)号：US11990557B2

公开(公告)日：2024-05-21

申请号：US17083763

申请日：2020-10-29

Applicant: PixArt Imaging Inc.

Inventor： Chi-Chih Shen ,  Kuo-Hsiung Li ,  Shang-Feng Hsieh ,  Jui-Cheng Chuang ,  Yi-Chang Chang

IPC: H01L31/14 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L31/143 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/186

Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.

公开(公告)号：US11156796B2

公开(公告)日：2021-10-26

申请号：US16701364

申请日：2019-12-03

Applicant: PIXART IMAGING INC.

Inventor： Chi-Chih Shen

IPC: G02B7/02 ,  H04N5/225 ,  H01L27/146 ,  G02B27/00 ,  G02B5/00

Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly includes a frame and a shielding element. The shielding element has a first light-permeable region disposed above at least a first subset of the pixels, the first subset is configured to receive corresponding light, and the first light-permeable region is transparent to the corresponding light. The shielding element includes an engaging structure formed thereon, and the shielding element is engaged with the frame by the engaging structure.

公开(公告)号：US10529759B2

公开(公告)日：2020-01-07

申请号：US16410357

申请日：2019-05-13

Applicant: PIXART IMAGING INC.

Inventor： Chi-Chih Shen

IPC: H01L27/146 ,  G06F21/32 ,  G06K9/00 ,  H01L25/16 ,  H01L23/31

Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.