Abstract:
A joint structure and a manufacturing method thereof are provided which can improve heat dissipation properties and which can inhibit damages. A joint structure includes: an insulating substrate and a heat dissipation substrate; a first silver particle layer that is joined to the insulating substrate and that includes a plurality of first silver nanoparticles which are joined; a second silver particle layer that is joined to the heat dissipation substrate and that includes a plurality of second silver nanoparticles which are joined; and a copper particle layer that interposes the first silver particle layer and the second silver particle layer, that is joined to the first silver particle layer and the second silver particle layer, and that includes a plurality of copper nanoparticles which are joined. A particle size of the copper nanoparticles is larger than particle size of both the first silver nanoparticles and the second silver nanoparticles.
Abstract:
A light-emitting module is provided. The light-emitting module includes an insulating substrate. The insulating substrate includes a mounting surface, a rear surface, and a through hole that passes from the mounting surface to the rear surface. A light-emitting element is on the mounting surface. A thermal conductor is disposed in the through hole in contact with an inner wall of the insulating substrate defined by the through hole. The thermal conductor includes a mounting-side end face thermally connected to the light-emitting element, a rear-side end face, and a displacement suppressing portion that suppresses displacement of the thermal conductor in a direction from the rear surface to the mounting surface. thermal conductor. The rear-side end, in a cross-section parallel to the rear surface of the insulating surface, is larger in surface area than the mounting-side end, in a cross-section parallel to the mounting surface of the insulating substrate.
Abstract:
A power supply device includes a DC power supply circuit configured to output DC power, and a ground-fault determining circuit configured to determine presence or absence of a ground fault at a post-stage of the DC power supply circuit. The ground-fault determining circuit includes a capacitor having an end that is connected with ground, and a diode including an anode and a cathode. The anode is connected with another end of the capacitor, and the cathode is connected with an output end on a high voltage side of the DC power supply circuit. The ground-fault determining circuit further includes a constant voltage source configured to charge the capacitor with a prescribed charging voltage, and a comparator as a determining portion configured to determine presence of the ground fault when a voltage across the capacitor falls below a prescribed determination reference voltage lower than the prescribed charging voltage.