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公开(公告)号：US20220223570A1
公开(公告)日：2022-07-14
申请号：US17614249
申请日：2020-05-27
IPC分类号： H01L25/075 , H01L33/62 , H01L33/46 , H01L33/00 , H01L27/14
摘要： In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component includes a semiconductor body having an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face, an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components, wherein the output element is arranged at the radiation outlet sides of the semiconductor components, wherein the electrical connection structure is electrically conductively connected with the contact structure, and wherein the connection structure includes an adhesive layer, a growth layer and a connection layer.
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公开(公告)号：US12040317B2
公开(公告)日：2024-07-16
申请号：US17541761
申请日：2021-12-03
发明人： Michael Brandl , Andreas Dobner , Matthias Goldbach , Sebastian Wittmann , Uli Hiller , Markus Klein , Thomas Schwarz , Andreas Waldschik , Michael Wittmann , Matthias Bruckschloegl , Stefan Groetsch , Rainer Huber , Peter Brick , Ludwig Hofbauer
IPC分类号： H04W72/20 , H01L25/075 , H01L33/46 , H01L33/62 , H01L33/64 , H04W72/51 , B60J3/00 , B60K35/00 , B60K35/60 , B62J50/22
CPC分类号： H01L25/0756 , H01L33/46 , H01L33/62 , H01L33/641 , H04W72/20 , H04W72/51 , B60J3/00 , B60K35/00 , B60K35/60 , B60K2370/785 , B62J50/22
摘要： An optoelectronic device comprises a plurality of optoelectronic light sources being arranged on a first layer, in particular an intermediate layer being arranged between a cover layer and a carrier layer. The first layer comprises or consists of an at least partially transparent material and each optoelectronic light source of the plurality of optoelectronic light sources comprises an individual light converter for converting light emitted by the associated light source into converted light. The light converter of each optoelectronic light source is arranged on the first layer and/or the associated optoelectronic light source.
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公开(公告)号：US20220013699A1
公开(公告)日：2022-01-13
申请号：US17294090
申请日：2019-11-11
IPC分类号： H01L33/62 , H01L25/075 , H01L33/00
摘要： A method of producing a plurality of radiation-emitting components includes providing a composite with a plurality of connection carriers, wherein each connection carrier includes a light-transmissive matrix in which vias are arranged extending therethrough from a first main surface of the connection carrier to a second main surface of the connection carrier, and the connection carriers are spaced from each other by frames surrounding each connection carrier, arranging a radiation-emitting semiconductor chip on two vias, and separating the components by removing all or part of the frames.
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公开(公告)号：US20240278645A1
公开(公告)日：2024-08-22
申请号：US18652629
申请日：2024-05-01
发明人： Matthias GOLDBACH , Stefan Grötsch , Lugwig Hofbauer , Sebastian Wittmann , Robert Regensburger , Thomas Schwarz , Michael Brandl , Andreas Dobner , Sebastian Stigler
CPC分类号： B60K35/00 , H01B3/30 , H01B7/0018 , H01B13/103 , H01L33/62 , B60K35/60 , B60K2360/332 , B60K2360/47 , B60K2360/48 , B60K2360/785 , H01L2933/0066
摘要： It is provided a window of a vehicle, optoelectronic circuits, in particular optoelectronic circuits for a window of a vehicle and a method for manufacturing a window of a vehicle including at least one optoelectronic component. It is further provided a display comprising at least one display module each comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED. In addition, a method for manufacturing a display module comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED, is provided.
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公开(公告)号：US20220149019A1
公开(公告)日：2022-05-12
申请号：US17541798
申请日：2021-12-03
发明人： Michael Brandl , Andreas Dobner , Matthias Goldbach , Sebastian Wittmann , Uli Hiller , Markus Klein , Thomas Schwarz , Andreas Waldschik , Michael Wittmann , Matthias Bruckschloegl , Stefan Groetsch , Rainer Huber , Peter Brick , Ludwig Hofbauer
IPC分类号： H01L25/075 , H01L33/46 , H01L33/62 , H01L33/64
摘要： An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.
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