Active damper for semiconductor metrology and inspection systems

    公开(公告)号:US11280381B2

    公开(公告)日:2022-03-22

    申请号:US16422511

    申请日:2019-05-24

    摘要: A damper for a semiconductor metrology or inspection system includes a pair of parallel plates with a fluid with a variable viscosity retained between plates. At least one wire is disposed between the plates, which may include one or more sets of lands and grooves. In some implementations, both plates include intermeshed lands and grooves. A controller is configured to provide a current to the at least one wire in order to adjust an electromagnetic field or a current through the fluid. The fluid may be a magnetorheological fluid or an electrorheological fluid in which the viscosity of the fluid is variable based on the electromagnetic field or current through the fluid. The controller varies the current applied to the wire to adjust the viscosity of the fluid to alter the damping of the semiconductor metrology or inspection system based on movement of the stage.

    ACTIVE DAMPER FOR SEMICONDUCTOR METROLOGY AND INSPECTION SYSTEMS

    公开(公告)号:US20200370619A1

    公开(公告)日:2020-11-26

    申请号:US16422511

    申请日:2019-05-24

    摘要: A damper for a semiconductor metrology or inspection system includes a pair of parallel plates with a fluid with a variable viscosity retained between plates. At least one wire is disposed between the plates, which may include one or more sets of lands and grooves. In some implementations, both plates include intermeshed lands and grooves. A controller is configured to provide a current to the at least one wire in order to adjust an electromagnetic field or a current through the fluid. The fluid may be a magnetorheological fluid or an electrorheological fluid in which the viscosity of the fluid is variable based on the electromagnetic field or current through the fluid. The controller varies the current applied to the wire to adjust the viscosity of the fluid to alter the damping of the semiconductor metrology or inspection system based on movement of the stage.

    FOUP purge shield
    3.
    发明授权

    公开(公告)号:US10784136B2

    公开(公告)日:2020-09-22

    申请号:US16048200

    申请日:2018-07-27

    IPC分类号: H01L21/67 H01L21/673 B08B5/00

    摘要: A load port for loading wafers to and unloading wafers from a front opening unified pod (FOUP) includes a shield member that covers and provides a seal over an opening of the FOUP. The shield member includes a narrow wafer slot that is sized to allow a single wafer to be loaded to or unloaded from the FOUP but otherwise minimize loss of the purge environment within the FOUP. The shield member is movable so that the wafer slot may be moved vertically to provide a wafer transfer robot access to any desired wafer position within the FOUP. The shield member, for example, may be a flexible sheet that is held taut and is rolled onto and off of at least one roller to vertically position the wafer slot. The shield member may alternatively be one or more rigid members that slide on rails to vertically position the wafer slot.