公开(公告)号：US11064299B2

公开(公告)日：2021-07-13

申请号：US16315965

申请日：2017-02-21

Applicant: OMRON Corporation

Inventor： Ayumu Murakami ,  Tadashi Inoue ,  Yasuhiro Horimoto

IPC: H04R25/00 ,  H04R7/22 ,  B81B3/00 ,  H04R1/02 ,  H04R7/08 ,  H04R17/02

Abstract: A MEMS structure that includes: a substrate having an opening; a diaphragm arranged opposite the opening in the substrate; a plurality of anchors securing the diaphragm to the substrate or to another component; and a fixed membrane surrounding the diaphragm over a slit. The outline of the diaphragm protrudes toward the anchors and includes a predetermined intersecting structure that when viewed from the normal to the diaphragm, the diaphragm protrudes toward the anchors in at least one location on the diaphragm between two intersection points of the outline of the diaphragm and the outline of the opening in the substrate. The intersecting structure is configured such that the distance between the two intersection points is greater than the width of the diaphragm at a location closest to an anchor.

公开(公告)号：US09380392B2

公开(公告)日：2016-06-28

申请号：US14635833

申请日：2015-03-02

Applicant: OMRON Corporation

Inventor： Daisuke Kuzuyama ,  Yasuhiro Horimoto ,  Sayaka Naito

IPC: H04R19/00

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81C1/0023 ,  H01L2224/48137

Abstract: A microphone has a MEMS acoustic transducer having a frame-shaped support, and a membrane including a diaphragm as a movable electrode, covering an opening in the support, an integrated circuit that amplifies the output from the MEMS acoustic transducer, and a housing that houses the MEMS acoustic transducer and the integrated circuit. The housing includes a sound port bearing partition with a sound port formed therein. The MEMS acoustic transducer is secured in the housing with the membrane thereof facing the inner surface of the sound port bearing partition to form a closed space inward of the sound port bearing partition of the housing between the membrane and the sound port bearing partition. The closed space communicates with the outside via the sound port.

Abstract translation: 麦克风具有MEMS声学换能器，其具有框架形支撑件，以及包括膜片作为可动电极的膜，覆盖支撑体中的开口，放大来自MEMS声换能器的输出的集成电路和容纳 MEMS声学传感器和集成电路。 壳体包括形成在其中形成声音端口的声音承载隔板。 MEMS声换能器被固定在壳体中，其膜面向声音孔支承隔板的内表面，以在隔膜和声音承载隔板之间形成壳体的声口支承隔板的封闭空间。 封闭空间通过声音端口与外部通信。

公开(公告)号：US20150264463A1

公开(公告)日：2015-09-17

申请号：US14635833

申请日：2015-03-02

Applicant: OMRON Corporation

Inventor： Daisuke Kuzuyama ,  Yasuhiro Horimoto ,  Sayaka Naito

IPC: H04R1/08

CPC classification number: H04R19/005 ,  B81B2201/0257 ,  B81C1/0023 ,  H01L2224/48137

Abstract: A microphone has a MEMS acoustic transducer having a frame-shaped support, and a membrane including a diaphragm as a movable electrode, covering an opening in the support, an integrated circuit that amplifies the output from the MEMS acoustic transducer, and a housing that houses the MEMS acoustic transducer and the integrated circuit. The housing includes a sound port bearing partition with a sound port formed therein. The MEMS acoustic transducer is secured in the housing with the membrane thereof facing the inner surface of the sound port bearing partition to form a closed space inward of the sound port bearing partition of the housing between the membrane and the sound port bearing partition. The closed space communicates with the outside via the sound port.

Abstract translation: 麦克风具有MEMS声学换能器，其具有框架形支撑件，以及包括膜片作为可动电极的膜，覆盖支撑体中的开口，放大来自MEMS声换能器的输出的集成电路和容纳 MEMS声学传感器和集成电路。 壳体包括形成在其中形成声音端口的声音承载隔板。 MEMS声换能器被固定在壳体中，其膜面向声音孔支承隔板的内表面，以在隔膜和声音承载隔板之间形成壳体的声口支承隔板的封闭空间。 封闭空间通过声音端口与外部通信。