公开(公告)号：US20230076598A1

公开(公告)日：2023-03-09

申请号：US18049668

申请日：2022-10-26

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  En-Chi Li ,  Chi-Chih Huang

IPC: H01L27/146

Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.

公开(公告)号：US10185191B2

公开(公告)日：2019-01-22

申请号：US15226731

申请日：2016-08-02

Applicant: OmniVision Technologies, Inc.

Inventor： En-Chi Li ,  Chi-Chih Huang

IPC: G02F1/1362 ,  G02F1/1345

Abstract: A panel carrier includes a substrate, a die-attach region, a short sidewall, and a conductor. The die-attach region is on a top substrate surface of the substrate for supporting the LCoS panel. The short sidewall is on a first side of the die-attach region and has a top sidewall surface at a first height above the top substrate surface exceeding 0.4 millimeters and an aperture spanning the top sidewall surface and the top substrate surface. The conductor at least partially fills the aperture for electrically connecting to the conductive layer. A method for mechanically and electrically connecting a LCoS panel to a panel carrier having a short sidewall includes electrically connecting a transparent conductive layer of the LCoS panel to a conductive material, within the short sidewall, with a conductive adhesive having a thickness, between the transparent conductive layer and the short sidewall, less than two-hundred micrometers.

公开(公告)号：US09748293B1

公开(公告)日：2017-08-29

申请号：US15226691

申请日：2016-08-02

Applicant: OmniVision Technologies, Inc.

Inventor： En-Chi Li ,  Chi-Chih Huang ,  Wei-Feng Lin

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

Abstract: An image sensor package with a folded cover-glass sealing interface includes (a) an image sensor with a light-receiving surface, (b) a substrate having (i) a recessed surface to which the image sensor is bonded, (ii) a second surface facing in a direction parallel to optical axis of the image sensor, surrounding the recessed surface, and being further than the light-receiving surface from the recessed surface, and (iii) a third surface facing the optical axis, and adjoining and surrounding the second surface, and (c) a cover glass bonded to the substrate with a folded sealing-interface at the second surface and the third surface.

公开(公告)号：US10243014B2

公开(公告)日：2019-03-26

申请号：US15899900

申请日：2018-02-20

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang ,  En-Chi Li

IPC: H01L27/146

Abstract: A method of image sensor package fabrication includes forming a cavity in a ceramic substrate, and placing an image sensor in the cavity in the ceramic substrate. An image sensor processor is also placed in the cavity in the ceramic substrate, and the image sensor and the image sensor processor are wire bonded to electrical contacts. Glue is deposited on the ceramic substrate, and a glass layer is placed on the glue to adhere the glass layer to the ceramic substrate. The image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate.

公开(公告)号：US20240387588A1

公开(公告)日：2024-11-21

申请号：US18320606

申请日：2023-05-19

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang ,  En-Chi Li

IPC: H01L27/146

Abstract: An image sensor package with a multi-step cavity formed in or on a substrate, which includes an image sensor bonded onto bottom of the multi-step cavity, and a cover glass placed and sealed on a lower portion of the multi-step cavity. Lower portion of the multi-step cavity includes at least a first and a second raised-step structures protruding from the bottom of the multi-step cavity, and the cover glass is placed and sealed over the first raised-step structure.

公开(公告)号：US20180182797A1

公开(公告)日：2018-06-28

申请号：US15899900

申请日：2018-02-20

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang ,  En-Chi Li

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469

Abstract: A method of image sensor package fabrication includes forming a cavity in a ceramic substrate, and placing an image sensor in the cavity in the ceramic substrate. An image sensor processor is also placed in the cavity in the ceramic substrate, and the image sensor and the image sensor processor are wire bonded to electrical contacts. Glue is deposited on the ceramic substrate, and a glass layer is placed on the glue to adhere the glass layer to the ceramic substrate. The image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate.

公开(公告)号：US11973098B2

公开(公告)日：2024-04-30

申请号：US18049668

申请日：2022-10-26

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  En-Chi Li ,  Chi-Chih Huang

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687

Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.

公开(公告)号：US09935144B1

公开(公告)日：2018-04-03

申请号：US15362408

申请日：2016-11-28

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang ,  En-Chi Li

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469

Abstract: An image sensor package includes a ceramic substrate with a cavity disposed in the ceramic substrate. A glass layer is adhered to the ceramic substrate and encloses the cavity in the ceramic substrate. An image sensor is disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor. An image sensor processor is disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor.