公开(公告)号：US20200049972A1

公开(公告)日：2020-02-13

申请号：US16656788

申请日：2019-10-18

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Takahiro SHIMOHATA ,  Takuro SUYAMA

IPC: G02B23/24 ,  H04N5/225 ,  H01L27/146

Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.

公开(公告)号：US20240047500A1

公开(公告)日：2024-02-08

申请号：US18382579

申请日：2023-10-23

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA

IPC: H01L27/146 ,  H04N23/50

CPC classification number: H01L27/1464 ,  H04N23/555 ,  H01L27/14636 ,  H01L27/14685

Abstract: An image pickup unit includes: a bonded device provided with a light receiving surface, an undersurface, and four side faces, the bonded device including a light receiving element provided with a light receiving circuit, and a circuit element provided with a peripheral circuit and direct-bonded to the light receiving element; a first protective layer covering the four side faces, the first protective layer being made of an inorganic material; a second protective layer covering the first protective layer, the second protective layer being made of metal; and a third protective layer covering the second protective layer, the third protective layer being made of an organic material.

公开(公告)号：US20200344386A1

公开(公告)日：2020-10-29

申请号：US16924280

申请日：2020-07-09

Applicant: OLYMPUS CORPORATION

Inventor： Ken YAMAMOTO ,  Takatoshi IGARASHI ,  Takuro SUYAMA ,  Kazuhiro YOSHIDA ,  Kensuke SUGA

IPC: H04N5/225 ,  G02B23/24 ,  H01L27/146 ,  A61B1/00 ,  A61B1/05

Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

公开(公告)号：US20210250473A1

公开(公告)日：2021-08-12

申请号：US17241685

申请日：2021-04-27

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA

IPC: H04N5/225 ,  H01L27/146

Abstract: An image pickup apparatus includes: a wiring board including a mounting surface; an image pickup device mounted on the mounting surface, the image pickup device including, on a light-receiving surface thereof, a light-receiving section; an optical component including a first main surface and a second main surface, the second main surface being bonded to the light-receiving surface; an electronic component mounted on the mounting surface; and sealing resin disposed on the mounting surface, covering the image pickup device, located on the same surface as the first main surface and including a resin upper surface parallel to the mounting surface.

公开(公告)号：US20210141210A9

公开(公告)日：2021-05-13

申请号：US16656788

申请日：2019-10-18

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Takahiro SHIMOHATA ,  Takuro SUYAMA

IPC: G02B23/24 ,  H04N5/225 ,  H01L27/146

Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.

公开(公告)号：US20210109337A1

公开(公告)日：2021-04-15

申请号：US17128304

申请日：2020-12-21

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA

IPC: G02B23/24 ,  H01L27/146 ,  H04N5/225 ,  H04N5/38 ,  A61B1/04 ,  A61B1/00

Abstract: An image pickup apparatus includes an image pickup member and a laminated optical member that is fixed in frame-shaped fixed areas around respective optical path areas. The fixed areas include a first area and a second area. A width of the first area is greater than a width of the second area. In the laminated optical member, an optical surface central axis deviates from an optical axis toward the first area. In the image pickup member, an image pickup surface central axis that is a central axis of a first main surface deviates from the optical axis.

公开(公告)号：US20190274529A1

公开(公告)日：2019-09-12

申请号：US16416522

申请日：2019-05-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA ,  Takatoshi IGARASHI ,  Kensuke SUGA ,  Yoshiro NISHIMURA

IPC: A61B1/05 ,  G02B23/24 ,  H01L27/146 ,  A61B1/00 ,  H04N5/225

Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.

公开(公告)号：US20180308794A1

公开(公告)日：2018-10-25

申请号：US15959343

申请日：2018-04-23

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA

IPC: H01L23/522

Abstract: A semiconductor apparatus includes a semiconductor device having a semiconductor circuit formed on a first main surface, and including a via having an opening at a second main surface, a first wiring disposed on the first main surface of the semiconductor device, partially exposed at a bottom surface of the via, and connected to the semiconductor circuit, a first insulating layer covering the first wiring, and a redistribution wiring extending from a contact portion in contact with the first wiring at the bottom surface of the via, through an inside of the via and onto the second main surface, where a first through hole is formed in the first wiring, and the contact portion is in contact with a plurality of surfaces of the first wiring.

公开(公告)号：US20220352233A1

公开(公告)日：2022-11-03

申请号：US17864678

申请日：2022-07-14

Applicant: OLYMPUS CORPORATION

Inventor： Mitsuru HAGIHARA ,  Takuro SUYAMA

IPC: H01L27/146 ,  G02B23/24 ,  H04N5/225

Abstract: An image pickup apparatus includes an image pickup member including an image pickup device, a stacked device in which a plurality of semiconductor devices are stacked, a wiring board having a first principal surface and a second principal surface, the wiring board including a central section having a substrate thicker than the image pickup device, an intermediate section that is extended from the central section and is bent, and a terminal section that is extended from the intermediate section, the image pickup member being bonded to the first principal surface of the central section, the stacked device being bonded to the second principal surface of the central section, and a plurality of signal cables bonded to the terminal section.

公开(公告)号：US20200058693A1

公开(公告)日：2020-02-20

申请号：US16662362

申请日：2019-10-24

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA ,  Takatoshi IGARASHI

IPC: H01L27/146 ,  H01L23/00 ,  A61B1/00 ,  A61B1/05

Abstract: An endoscope includes an image pickup module, and the image pickup module includes: an image pickup device an external electrode being disposed on a back surface of the image pickup device; a wiring element provided with a through-hole passing through a first main surface and a second main surface, a first electrode on the first main surface being bonded with the external electrode; a signal cable bonded with a second electrode on the second main surface of the wiring element; and a first resin that seals a first bump bonding the first electrode and the external electrode and a second bump bonding the second electrode and the signal cable, and fills the through-hole.