公开(公告)号：US11581261B2

公开(公告)日：2023-02-14

申请号：US17186005

申请日：2021-02-26

Applicant: Novatek Microelectronics Corp.

Inventor： Chun-Yu Liao ,  Teng-Jui Yu ,  Jr-Ching Lin ,  Wen-Ching Huang ,  Tai-Hung Lin

IPC: H01L23/52 ,  H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367

Abstract: A chip on film package is disclosed, including a flexible film and a chip. The flexible film includes a film base, a patterned metal layer includes a plurality of pads and disposed on an upper surface of the film base, and a dummy metal layer covering a lower surface of the film base and capable of dissipating heat of the chip. The dummy metal layer comprises at least one opening exposing the second surface, and at least one of the plurality of pads is located within the at least one opening in a bottom view of the chip on film package. The chip is mounted on the plurality of pads of the patterned metal layer.

公开(公告)号：US20210183781A1

公开(公告)日：2021-06-17

申请号：US17186005

申请日：2021-02-26

Applicant: Novatek Microelectronics Corp.

Inventor： Chun-Yu Liao ,  Teng-Jui Yu ,  Jr-Ching Lin ,  Wen-Ching Huang ,  Tai-Hung Lin

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367

Abstract: A chip on film package is disclosed, including a flexible film and a chip. The flexible film includes a film base, a patterned metal layer includes a plurality of pads and disposed on an upper surface of the film base, and a dummy metal layer covering a lower surface of the film base and capable of dissipating heat of the chip. The dummy metal layer comprises at least one opening exposing the second surface, and at least one of the plurality of pads is located within the at least one opening in a bottom view of the chip on film package. The chip is mounted on the plurality of pads of the patterned metal layer.

公开(公告)号：US10937713B2

公开(公告)日：2021-03-02

申请号：US16005710

申请日：2018-06-12

Applicant: Novatek Microelectronics Corp.

Inventor： Chun-Yu Liao ,  Teng-Jui Yu ,  Jr-Ching Lin

IPC: H01L23/50 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00

Abstract: A chip on film package is disclosed, including a flexible film, a patterned circuit layer, a chip, and a dummy metal layer. The flexible film includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The chip is mounted on the first surface and electrically connected to the patterned circuit layer. The dummy metal layer covers the second surface capable of dissipating heat of the chip. The dummy metal layer is electrically insulated from the patterned circuit layer.

公开(公告)号：US11189597B2

公开(公告)日：2021-11-30

申请号：US16172884

申请日：2018-10-29

Applicant: Novatek Microelectronics Corp.

Inventor： Chun-Yu Liao ,  Teng-Jui Yu

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L23/538

Abstract: A chip on film package including a flexible film, a first patterned circuit layer, one or more first chips, a second patterned circuit layer, and one or more second chips. The flexible film includes a first surface and a second surface opposite to the first surface. The first patterned circuit layer is disposed on the first surface. The one or more first chips are mounted on the first surface and electrically connected to the first patterned circuit layer. The second patterned circuit layer is disposed on the second surface. The one or more second chips are mounted on the second surface and electrically connected to the second patterned circuit layer.

公开(公告)号：US11170685B2

公开(公告)日：2021-11-09

申请号：US17008813

申请日：2020-09-01

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： Jhih-Ming Liao ,  Chun-Yu Liao ,  Teng-Jui Yu

IPC: G09G3/20

Abstract: A display device and a driving device thereof is disclosed. The driving device is coupled to a display panel. The driving device includes at least one first driver integrated circuit (IC) and at least one second driver integrated circuit (IC). The first driver integrated circuit is coupled to the display panel. The first driver integrated circuit drives the display panel and detects a first working temperature. The second driver integrated circuit is coupled to the display panel and the first driver IC. The second driver integrated circuit drives the display panel. The first driver IC stops driving the display panel and communicates with the second driver IC to stop driving the display panel when the first working temperature is substantially higher than a first given temperature.