公开(公告)号：US20140292364A1

公开(公告)日：2014-10-02

申请号：US13921973

申请日：2013-06-19

Applicant: National Applied Research Laboratories

Inventor： Yin-Cheng CHANG ,  Da-Chiang CHANG

IPC: G01R1/067

CPC classification number: G01R1/06761 ,  G01R1/06772 ,  G01R31/002 ,  G01R31/2886

Abstract: The present invention discloses a semiconductor chip probe for measuring conducted electromagnetic emission (EME) of a bare die and a conducted EME measurement apparatus with the semiconductor chip probe. The semiconductor chip probe comprises a substrate, a dielectric layer, an impedance unit, a measuring unit and a connection unit. The measurement apparatus comprises a semiconductor chip probe, a high frequency probe, a signal cable and a test receiver. The integrated passive component network designed and embedded inside the semiconductor chip probe forms the 1Ω or 150Ω impedance network. And the semiconductor chip probe is able to directly couple the EME conducted current or voltage from the test pin of the flipped chip under test to the test receiver for measurement.

Abstract translation: 本发明公开了一种用于测量裸片的传导电磁发射（EME）和带有半导体芯片探针的传导式EME测量装置的半导体芯片探针。 半导体芯片探针包括衬底，电介质层，阻抗单元，测量单元和连接单元。 测量装置包括半导体芯片探针，高频探针，信号电缆和测试接收器。 半导体芯片探针内部设计和嵌入的集成无源元件网络形成1＆OHgr; 或150＆OHgr; 阻抗网络。 并且半导体芯片探针能够将EME传导电流或电压从测试的被翻转芯片的测试引脚耦合到测试接收器进行测量。

公开(公告)号：US20170131494A1

公开(公告)日：2017-05-11

申请号：US15002003

申请日：2016-01-20

Applicant: National Applied Research Laboratories

Inventor： Chao-Ping HSIEH ,  Yin-Cheng CHANG ,  Ta-Yeh LIN ,  Da-Chiang CHANG

IPC: G02B6/42 ,  H04B10/80 ,  G02B6/43

CPC classification number: G02B6/4281 ,  G02B6/4246 ,  G02B6/4277 ,  G02B6/43 ,  H04B10/802 ,  H05K1/0227 ,  Y02E10/50

Abstract: The present invention provides a package framework for a photoelectric conversion module, in which a photoelectric device is mounted on a printed circuit board such as a rigid-flex PCB and a HDI (High Density Interconnect) PCB, and then is connected, via a flexible printed circuit board, to a traditional printed circuit board having a driver chip or a digital signal processing integrated circuit disposed thereon. The present invention can prevent signal transmission interference caused by using bond wire, and can also maintain the stability of mechanical structure.

公开(公告)号：US20150268272A1

公开(公告)日：2015-09-24

申请号：US14264503

申请日：2014-04-29

Applicant: National Applied Research Laboratories

Inventor： Yin-Cheng CHANG ,  Da-Chiang CHANG

IPC: G01R1/067 ,  G01R1/20

CPC classification number: G01R1/06766 ,  G01R1/203

Abstract: A conducted type current probe is provided herein and comprises a plurality of first resistors, at least one second resistor, a first connective port, and a second connective port. The first resistors are connected in parallel to form a resistor with 1Ω resistance value, and the resistance value of the second resistor is 49Ω. The first resistors and the second resistor are connected. The first connective port is connected with a test end of a test Integrated Circuit (IC), and the second connective port is connected with a test receiver by a coaxial cable.

Abstract translation: 本文提供了一种传导型电流探针，包括多个第一电阻器，至少一个第二电阻器，第一连接端口和第二连接端口。 第一个电阻并联连接，形成一个电阻器，并具有1＆OHgr; 电阻值，第二电阻器的电阻值为49Ω。 第一个电阻和第二个电阻连接。 第一个连接端口与测试集成电路（IC）的测试端连接，第二个连接端口通过同轴电缆与测试接收器连接。