公开(公告)号：US20170131494A1

公开(公告)日：2017-05-11

申请号：US15002003

申请日：2016-01-20

Applicant: National Applied Research Laboratories

Inventor： Chao-Ping HSIEH ,  Yin-Cheng CHANG ,  Ta-Yeh LIN ,  Da-Chiang CHANG

IPC: G02B6/42 ,  H04B10/80 ,  G02B6/43

CPC classification number: G02B6/4281 ,  G02B6/4246 ,  G02B6/4277 ,  G02B6/43 ,  H04B10/802 ,  H05K1/0227 ,  Y02E10/50

Abstract: The present invention provides a package framework for a photoelectric conversion module, in which a photoelectric device is mounted on a printed circuit board such as a rigid-flex PCB and a HDI (High Density Interconnect) PCB, and then is connected, via a flexible printed circuit board, to a traditional printed circuit board having a driver chip or a digital signal processing integrated circuit disposed thereon. The present invention can prevent signal transmission interference caused by using bond wire, and can also maintain the stability of mechanical structure.