公开(公告)号：US20140102172A1

公开(公告)日：2014-04-17

申请号：US14047137

申请日：2013-10-07

Applicant: NXP B.V.

Inventor： Roel Daamen ,  Aurelie Humbert ,  Pascal Bancken

IPC: G01N27/18 ,  G01N25/56

CPC classification number: G01N27/18 ,  G01N25/56 ,  G01N27/223 ,  G01N33/0032

Abstract: An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate. The integrated circuit also includes a relative humidity sensor on the substrate. The relative humidity sensor includes a first sensor electrode, a second sensor electrode, and a humidity sensitive layer covering the first and second electrodes. The integrated circuit further includes a thermal conductivity based gas sensor on the substrate. The thermal conductivity based gas sensor has an electrically resistive sensor element located above the humidity sensitive layer.

Abstract translation: 一种集成电路及其制造方法。 集成电路包括半导体衬底。 集成电路还包括在基板上的相对湿度传感器。 相对湿度传感器包括第一传感器电极，第二传感器电极和覆盖第一和第二电极的湿度敏感层。 集成电路还包括在基板上的基于热导率的气体传感器。 基于导热系数的气体传感器具有位于湿度敏感层上方的电阻传感器元件。

公开(公告)号：US09891183B2

公开(公告)日：2018-02-13

申请号：US14793257

申请日：2015-07-07

Applicant: NXP B.V.

Inventor： Roel Daamen ,  Viet Hoang Nguyen ,  Nebojsa Nenadovic ,  Pascal Bancken

IPC: G01N27/24 ,  G01N27/22 ,  G06F21/87 ,  H01L23/00 ,  G01N21/88

CPC classification number: G01N27/223 ,  G01N21/8851 ,  G01N27/24 ,  G01N2021/8854 ,  G06F21/87 ,  H01L23/57 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: One example discloses a breach sensor, comprising: a substrate including an integrated circuit; a passivation layer coupled to the substrate; a breach sensing element coupled to the circuit; wherein the breach sensing element is on a first side of the passivation layer and the substrate is on a second side of the passivation layer; a barrier configured to separate the breach sensing element from an ambient environment; wherein the breach sensing element is responsive to barrier damage.

公开(公告)号：US20170010232A1

公开(公告)日：2017-01-12

申请号：US14793257

申请日：2015-07-07

Applicant: NXP B.V.

Inventor： Roel Daamen ,  Viet Hoang Nguyen ,  Nebojsa Nenadovic ,  Pascal Bancken

IPC: G01N27/22 ,  G01N21/88

CPC classification number: G01N27/223 ,  G01N21/8851 ,  G01N27/24 ,  G01N2021/8854 ,  G06F21/87 ,  H01L23/57 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: One example discloses a breach sensor, comprising: a substrate including an integrated circuit; a passivation layer coupled to the substrate; a breach sensing element coupled to the circuit; wherein the breach sensing element is on a first side of the passivation layer and the substrate is on a second side of the passivation layer; a barrier configured to separate the breach sensing element from an ambient environment; wherein the breach sensing element is responsive to barrier damage.

Abstract translation: 一个实例公开了一种破裂传感器，包括：包括集成电路的基板; 耦合到所述衬底的钝化层; 耦合到所述电路的漏电传感元件; 其中所述漏泄感测元件位于所述钝化层的第一侧上，并且所述衬底位于所述钝化层的第二侧上; 阻挡构造成将破裂传感元件与周围环境分离; 其中所述破裂传感元件响应于屏障损坏。