公开(公告)号：US20240268022A1

公开(公告)日：2024-08-08

申请号：US18289769

申请日：2022-08-23

Applicant: NOF CORPORATION

Inventor： Toshinobu FUJIMURA ,  Katsumi NAKASATO ,  Muneaki IIZUKA

IPC: H05K1/05 ,  C23C16/40 ,  C23C16/448 ,  H01L21/48 ,  H01L23/373 ,  H05K1/02 ,  H05K3/44

CPC classification number: H05K1/053 ,  C23C16/403 ,  C23C16/4486 ,  H01L21/4846 ,  H01L23/3735 ,  H05K1/0209 ,  H05K3/44 ,  H05K2201/0179 ,  H05K2201/0191 ,  H05K2203/088

Abstract: According to the present invention, a heat-dissipating circuit board is formed by providing a metal material adjacent to one surface of an insulating layer and providing a conductive metal layer to the other surface of the insulating layer. The metal material is a sheet of copper or a copper alloy or aluminum or an aluminum alloy and is 0.2-20 mm thick. The insulating layer is a metal oxide layer that has the composition AlxOyTz, is 0.2-30 μm thick, has a volume resistivity of at least 1000 GΩ·cm, and has a porosity of no more than 10%. The heat-dissipating circuit board has excellent heat-dissipation properties and insulation properties.