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公开(公告)号：US20220315739A1
公开(公告)日：2022-10-06
申请号：US17846572
申请日：2022-06-22
Applicant: Tao Gu , NITTO DENKO CORPORATION
Inventor： Shimpei Yakuwa , Kou Uemura , Shunji Imamura , Tomoyuki Kasagi , Tao Gu
Abstract: Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.
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Patent Agency Ranking
公开(公告)号：US11884796B2
公开(公告)日：2024-01-30
申请号：US17846572
申请日：2022-06-22
Applicant: NITTO DENKO CORPORATION , Tao Gu
Inventor： Shimpei Yakuwa , Kou Uemura , Shunji Imamura , Tomoyuki Kasagi , Tao Gu
CPC classification number: C08K7/26 , C08K3/36 , H05K1/0373 , C08K2201/002 , C08K2201/003 , C08K2201/006 , C08K2201/011 , H05K2201/015 , H05K2201/0209
Abstract: Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.
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公开(公告)号：US20200079931A1
公开(公告)日：2020-03-12
申请号：US16615623
申请日：2018-05-30
Applicant: Tao Gu , NITTO DENKO CORPORATION
Inventor： Shimpei Yakuwa , Kou Uemura , Shunji Imamura , Tomoyuki Kasagi , Tao Gu
Abstract: Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.
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公开(公告)号：US11453762B2
公开(公告)日：2022-09-27
申请号：US16615623
申请日：2018-05-30
Applicant: NITTO DENKO CORPORATION , Tao Gu
Inventor： Shimpei Yakuwa , Kou Uemura , Shunji Imamura , Tomoyuki Kasagi , Tao Gu
Abstract: Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.
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公开(公告)号：US11472165B2
公开(公告)日：2022-10-18
申请号：US17263695
申请日：2019-07-31
Applicant: NITTO DENKO CORPORATION
Inventor： Shunji Imamura , Shimpei Yakuwa , Kou Uemura , Tomoyuki Kasagi , Yuya Kitagawa
Abstract: A plate-like composite material in which peeling of a conductor layer and the like serving as wiring is less liable to occur is provided. The plate-like composite material includes: a pore-containing layer, which contains a fluororesin and a filler, and which contains pores; and a resin layer containing a fluororesin bonded to one surface, or each of both surfaces, of the pore-containing layer, wherein the pore-containing layer includes, in a vicinity of an interface with the resin layer, a high resin content region, which contains the fluororesin in a content higher than a content in a remaining region of the pore-containing layer, and which contains the pores in a content lower than a content in the remaining region, and wherein the high resin content region has a thickness starting from the interface of from 0.20 μm to 10 μm.
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公开(公告)号：US20210221106A1
公开(公告)日：2021-07-22
申请号：US17263695
申请日：2019-07-31
Applicant: NITTO DENKO CORPORATION
Inventor： Shunji Imamura , Shimpei Yakuwa , Kou Uemura , Tomoyuki Kasagi
Abstract: A plate-like composite material in which peeling of a conductor layer and the like serving as wiring is less liable to occur is provided. The plate-like composite material includes: a pore-containing layer, which contains a fluororesin and a filler, and which contains pores; and a resin layer containing a fluororesin bonded to one surface, or each of both surfaces, of the pore-containing layer, wherein the pore-containing layer includes, in a vicinity of an interface with the resin layer, a high resin content region, which contains the fluororesin in a content higher than a content in a remaining region of the pore-containing layer, and which contains the pores in a content lower than a content in the remaining region, and wherein the high resin content region has a thickness starting from the interface of from 0.20 μm to 10 μm.
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