Abstract:
Provided is a method by which a retardation film suppressed in biaxiality, having a small Nz coefficient, and having a slow axis in an oblique direction can be produced with high production efficiency. The production method for a retardation film of the present invention includes: holding left and right end portions of a film with left and right variable pitch-type clips configured to have clip pitches changing in a longitudinal direction, respectively; preheating the film; reducing, under a state in which the clip pitch of the clips on one side out of the left and right clips is kept constant, the clip pitch of the clips on another side to obliquely stretch the film; and releasing the film from being held with the clips.
Abstract:
The present invention provides a method capable of producing a retardation film having an elongated shape, having high uniaxiality and a high in-plane alignment property, and having a slow axis in an oblique direction with high production efficiency. The production method for a retardation film of the present invention includes: holding left and right end portions of a film with left and right variable pitch-type clips configured to have clip pitches changing in a longitudinal direction, respectively; preheating the film; increasing the clip pitch of the clips on one side and reducing the clip pitch of the clips on another side, while extending a distance between the left and right clips, to obliquely stretch the film; maintaining or reducing the clip pitch of the clips on the one side and increasing the clip pitch of the clips on the another side so that the clip pitches of the left and right clips are equal to each other, while extending the distance between the left and right clips, to obliquely stretch the film; and releasing the film from being held with the clips.
Abstract:
An objective of the present invention is to provide a brittle material chip and the like having excellent flexibility. The present invention is a brittle material chip including a brittle material layer formed of a brittle material. The brittle material chip includes first processed marks formed on one side in a thickness direction of the brittle material layer on at least one end surface of the brittle material layer and having depths of 1 μm or more and less than half the thickness of the brittle material layer and includes or does not include second processed marks formed on the other side in the thickness direction on the end surface of the brittle material layer, facing the first processed marks in the thickness direction, and having depths of less than 1 μm.