公开(公告)号：US11910113B2

公开(公告)日：2024-02-20

申请号：US17056064

申请日：2019-05-22

申请人： NIKON CORPORATION

发明人： Ryoji Ando ,  Toru Takagi ,  Shutaro Kato ,  Yoshiyuki Watanabe ,  Takashi Seo

IPC分类号： H04N25/75 ,  H01L27/146 ,  H04N25/766 ,  H04N25/772

CPC分类号： H04N25/75 ,  H01L27/14612 ,  H01L27/14623 ,  H04N25/766 ,  H04N25/772

摘要： An image sensor includes: a first photoelectric conversion unit that photoelectrically converts light to generate an electric charge; a first output unit that outputs a first signal based on the electric charge generated by the first photoelectric conversion unit; a plurality of second photoelectric conversion units that photoelectrically convert light to generate electric charges; a plurality of second output units that output second signals based on the electric charges generated by the second photoelectric conversion units; an output line to which the first output unit and the plurality of second output units are connected, and from which at least one of the first signal and the second signals is output; a first control line for controlling the output of the first signal from the first output unit; and second control lines for controlling the outputs of the second signals from the plurality of second output units.

公开(公告)号：US11152420B2

公开(公告)日：2021-10-19

申请号：US16861592

申请日：2020-04-29

申请人： NIKON CORPORATION

发明人： Shigeru Matsumoto ,  Toru Takagi

IPC分类号： H01L27/146 ,  H04N5/374 ,  H04N5/3745 ,  H04N5/369 ,  H04N5/378

摘要： A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.

公开(公告)号：US20180292310A1

公开(公告)日：2018-10-11

申请号：US16003882

申请日：2018-06-08

申请人： NIKON CORPORATION

发明人： Takanori KOJIMA ,  Satoru Odate ,  Toru Takagi

IPC分类号： G01N21/21 ,  H01L27/146 ,  G01N21/31 ,  G06T7/521 ,  G06T15/00 ,  A61B1/00 ,  A61B1/04 ,  A61B1/06

摘要： A polarization property image measurement device includes: a first radiation unit that radiates light beams in different polarization conditions onto a target object after subjecting the light beams to intensity modulation at frequencies different from one another; a light receiving unit including first photoelectric conversion units that photoelectrically convert the light beams having been radiated from the first radiation unit and scattered at the target object in correspondence to each of the different polarization conditions, and second photoelectric conversion units that photoelectrically convert visible light from the target object; and a processor that detects signals individually output from the first photoelectric conversion units at the different frequencies and differentiates each signal from other signals so as to determine an origin of the signal as one of the light beams; and creates an image of the target object based upon signals individually output from the second photoelectric conversion units.

公开(公告)号：US10937823B2

公开(公告)日：2021-03-02

申请号：US16823673

申请日：2020-03-19

申请人： NIKON CORPORATION

发明人： Tadashi Narui ,  Toru Takagi

IPC分类号： H01L27/146 ,  H04N5/369 ,  H04N5/378 ,  H04N5/347 ,  H04N7/18

摘要： An image-capturing element manufacturing method includes: preparing a first substrate having a plurality of pixels that are two-dimensionally continuously arrayed; preparing a second substrate having a plurality of circuit blocks that respectively have connection terminals to a power supply and a reference potential and that are electrically independent from each other, each of the plurality of circuit blocks having at least some of circuits to read out signals from the plurality of pixels; laminating the first substrate and the second substrate to electrically couple the plurality of circuit blocks and the plurality of pixels overlapping therewith; and cutting circuit blocks around at least one of the plurality of circuit blocks and pixels overlapping therewith to form a laminate in which the plurality of pixels are laminated onto the at least one of the plurality of circuit blocks.

公开(公告)号：US10680031B2

公开(公告)日：2020-06-09

申请号：US16084908

申请日：2017-02-28

申请人： NIKON CORPORATION

发明人： Shigeru Matsumoto ,  Toru Takagi

IPC分类号： H01L27/146 ,  H04N5/374 ,  H04N5/3745 ,  H04N5/369 ,  H04N5/378

摘要： A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.

公开(公告)号：US11057578B2

公开(公告)日：2021-07-06

申请号：US16283058

申请日：2019-02-22

申请人： NIKON CORPORATION

发明人： Masahiro Juen ,  Toru Takagi ,  Osamu Saruwatari ,  Wataru Funamizu ,  Sota Nakanishi

IPC分类号： H04N5/351 ,  H04N5/376 ,  H01L27/146 ,  H04N5/378

摘要： An image-capturing device allowing skew reduction, and an image-capturing system allowing skew reduction are provided. An image-capturing device is provided, including a plurality of photoelectric converting units; and a plurality of light-receiving units that are arranged corresponding to a plurality of blocks each constituted by one or more photoelectric converting units, and receive drive light instructing driving of the photoelectric converting units to output a drive signal to a corresponding photoelectric converting unit among the photoelectric converting units. In addition, an image-capturing system is provided, including the image-capturing device; and a light-emitting unit that is spaced apart from the plurality of light-receiving units, and emits the drive light to the plurality of light-receiving units.

公开(公告)号：US10686001B2

公开(公告)日：2020-06-16

申请号：US15765202

申请日：2016-09-26

申请人： NIKON CORPORATION

发明人： Toru Takagi ,  Satoshi Nakayama ,  Ryoji Ando ,  Takashi Seo ,  Yohei Matsuoka ,  Yoshiyuki Watanabe

IPC分类号： H01L27/146 ,  H01L31/0232 ,  H04N5/374

摘要： An image sensor includes: a photoelectric conversion unit that photoelectrically converts incident light transmitted through a microlens to generate electric charge; an accumulation unit that accumulates the electric charge generated by the photoelectric conversion unit; and a transfer unit that transfers the electric charge generated by the photoelectric conversion unit to the accumulation unit, wherein: the photoelectric conversion unit, the transfer unit, and the accumulation unit are provided along a direction of an optical axis of the microlens.

公开(公告)号：US11682690B2

公开(公告)日：2023-06-20

申请号：US17484535

申请日：2021-09-24

申请人： NIKON CORPORATION

发明人： Shigeru Matsumoto ,  Toru Takagi

IPC分类号： H01L27/146 ,  H04N25/75 ,  H04N25/76 ,  H04N25/79 ,  H04N25/771 ,  H04N25/772

CPC分类号： H01L27/14643 ,  H01L27/146 ,  H01L27/1464 ,  H01L27/14603 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14687 ,  H04N25/75 ,  H04N25/76 ,  H04N25/771 ,  H04N25/772 ,  H04N25/79

摘要： A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.

公开(公告)号：US10720465B2

公开(公告)日：2020-07-21

申请号：US16084908

申请日：2017-02-28

申请人： NIKON CORPORATION

发明人： Shigeru Matsumoto ,  Toru Takagi

IPC分类号： H01L27/146 ,  H04N5/374 ,  H04N5/3745 ,  H04N5/369 ,  H04N5/378

摘要： A first circuit layer including a first semiconductor substrate with photoelectric conversion unit that photoelectrically converts incident light and generates charge, and a first wiring layer with wiring that reads out signal based upon charge generated by the photoelectric conversion unit; second circuit layer including a second wiring layer with wiring connected to the wiring of the first wiring layer, and a second semiconductor substrate with a through electrode connected to the wiring of the second wiring layer; third circuit layer including a third semiconductor substrate with a through electrode connected to the through electrode of the second circuit layer, and third wiring layer with wiring connected to the through electrode of the third semiconductor substrate; and a fourth circuit layer including a fourth wiring layer with wiring connected to the wiring of the third wiring layer, and fourth semiconductor substrate connected to the wiring of the fourth wiring layer.

公开(公告)号：US11268900B2

公开(公告)日：2022-03-08

申请号：US16781474

申请日：2020-02-04

申请人： NIKON CORPORATION

发明人： Takanori Kojima ,  Satoru Odate ,  Toru Takagi

IPC分类号： G01N21/21 ,  G01N21/31 ,  G01N21/25 ,  G01J3/51 ,  G01J3/28 ,  G01J3/02 ,  G01J4/04 ,  G01J4/00 ,  G01J3/00 ,  H01L27/146 ,  G06T15/00 ,  A61B1/06 ,  A61B1/00 ,  A61B1/04 ,  G06T7/521 ,  G01N21/47 ,  G01J1/42

摘要： A polarization property image measurement device includes: a first radiation unit that radiates light beams in different polarization conditions onto a target object after subjecting the light beams to intensity modulation at frequencies different from one another; a light receiving unit including first photoelectric conversion units that photoelectrically convert the light beams having been radiated from the first radiation unit and scattered at the target object in correspondence to each of the different polarization conditions, and second photoelectric conversion units that photoelectrically convert visible light from the target object; and a processor that detects signals individually output from the first photoelectric conversion units at the different frequencies and differentiates each signal from other signals so as to determine an origin of the signal as one of the light beams; and creates an image of the target object based upon signals individually output from the second photoelectric conversion units.