专利检索 ap:("NICHIAS CORPORATION") AND inv:"Kaori Yamashita" 第 1 页

1.

发明授权
Thermally conductive cover for piping system, heating device for piping system, manufacturing method and attachment method for thermally conductive cover, and manufacturing method and attachment method for heating device 有权

公开(公告)号：US11009170B2

公开(公告)日：2021-05-18

申请号：US16483348

申请日：2017-02-16

申请人： NICHIAS CORPORATION

发明人： Kaori Yamashita

IPC分类号： H05B3/58 , F16L53/38 , F16B19/00 , F16L59/00 , F16L58/00

摘要： A thermally conductive cover improves workability of attachment and detachment. The thermally conductive cover includes a first thermal conductor on which a coupling hole is formed and a second thermal conductor on which a coupling hole is formed. The thermally conductive cover further includes a coupling member having a first inserted part to be inserted into the coupling hole and a second inserted part to be inserted into the coupling hole. At least one of the inserted parts is elastically deformable in a direction perpendicular to an inserting direction of the coupling member.