- 专利标题： Thermally conductive cover for piping system, heating device for piping system, manufacturing method and attachment method for thermally conductive cover, and manufacturing method and attachment method for heating device
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申请号： US16483348申请日： 2017-02-16
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公开(公告)号： US11009170B2公开(公告)日： 2021-05-18
- 发明人: Kaori Yamashita
- 申请人： NICHIAS CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： NICHIAS CORPORATION
- 当前专利权人： NICHIAS CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff PLC
- 国际申请： PCT/JP2017/005723 WO 20170216
- 国际公布： WO2018/150518 WO 20180823
- 主分类号： H05B3/58
- IPC分类号： H05B3/58 ; F16L53/38 ; F16B19/00 ; F16L59/00 ; F16L58/00
摘要：
A thermally conductive cover improves workability of attachment and detachment. The thermally conductive cover includes a first thermal conductor on which a coupling hole is formed and a second thermal conductor on which a coupling hole is formed. The thermally conductive cover further includes a coupling member having a first inserted part to be inserted into the coupling hole and a second inserted part to be inserted into the coupling hole. At least one of the inserted parts is elastically deformable in a direction perpendicular to an inserting direction of the coupling member.
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