Optical wavelength conversion device

    公开(公告)号:US11287107B2

    公开(公告)日:2022-03-29

    申请号:US16968693

    申请日:2018-10-31

    IPC分类号: F21V7/30 F21V29/70

    摘要: An optical wavelength conversion device includes an optical wavelength conversion member configured to convert the wavelength of incident light; a heat dissipation member which is more excellent in heat dissipation than the optical wavelength conversion member; and a joint portion which joins the optical wavelength conversion member and the heat dissipation member together. The optical wavelength conversion member includes a plate-shaped ceramic fluorescent body and a reflecting film disposed on a heat dissipation member-side surface of the ceramic fluorescent body. The joint portion has a thermal conductivity of 120 W/mK or more. The joint portion has a melting point of 240° C. or higher.

    Wavelength conversion member, light source device, and method for manufacturing wavelength conversion member

    公开(公告)号:US11692699B2

    公开(公告)日:2023-07-04

    申请号:US17624081

    申请日:2020-07-09

    IPC分类号: F21V29/503 F21V9/32

    CPC分类号: F21V29/503 F21V9/32

    摘要: A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.