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公开(公告)号：US11410895B2
公开(公告)日：2022-08-09
申请号：US16584074
申请日：2019-09-26
发明人： Yosuke Imoto , Shinichiro Haneishi , Kenji Suzuki , Norihiko Kawai , Naoki Kito
IPC分类号： H01L23/13 , H01L23/367 , H01L23/492 , H01L23/15
摘要： A wiring board has a metal-made base having a front surface and a back surface, an insulating frame body bonded to the front surface of the base through a bonding layer made of bonding material, a seating provided in an area that is located at an inner side with respect to the frame body on the front surface of the base, a mounting area where a component is supposed to be mounted on the front surface of the base, and a groove formed on the front surface of the base. The groove is arranged in at least an area between the mounting area and the seating on the front surface in plan view, and extends in a direction crossing an opposing direction of the mounting area and the seating.
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公开(公告)号：US10985087B2
公开(公告)日：2021-04-20
申请号：US16583959
申请日：2019-09-26
发明人： Yosuke Imoto , Shinichiro Haneishi , Kenji Suzuki , Norihiko Kawai , Naoki Kito
IPC分类号： H01L23/433 , H01L23/043 , H01L23/367 , H01L23/00 , H01L33/50 , H01L33/62 , H01L33/64 , H01L33/48
摘要： A wiring board has a metal-made base having a front surface and a back surface, an insulating frame body bonded to the front surface of the base through a bonding layer made of bonding material, a mounting area where a component is supposed to be mounted on the front surface of the base, and a restriction portion formed by a groove or a protrusion that is provided on the front surface of the base or by a combination of the groove and the protrusion. The restriction portion is arranged in at least a part of an area between the mounting area and the frame body on the front surface in plan view.
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