公开(公告)号：US20030047849A1

公开(公告)日：2003-03-13

申请号：US09952784

申请日：2001-09-11

申请人： Motorola, Inc.

发明人： Xunhu Dai ,  Rong Fong Huang

IPC分类号： C04B033/32

CPC分类号： H01L23/15 ,  C03C8/14 ,  C03C14/004 ,  C03C2214/20 ,  H01L21/4867 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/024 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H01L2924/00

摘要： A method to fabricate a printed circuit board with a low temperature coefficient of resonant frequency comprising the steps of mixing a volume of glass particles, a volume of filler material, and a volume of finely modifier powder. The function of the finely modifier powder is to adjust the low temperature of resonant frequency. The mixture is sintered at a temperature to form a low temperature cofired ceramic which will have a low temperature coefficient of resonant frequency that is approximately zero.

摘要翻译： 一种制造具有低谐振频率温度系数的印刷电路板的方法，包括以下步骤：混合体积的玻璃颗粒，一定体积的填充材料和一定体积的精细改性粉末。 精细调节剂粉末的功能是调节共振频率的低温。 将混合物在一定温度下烧结以形成低温共烧陶瓷，​​其将具有大约为零的谐振频率的低温度系数。

公开(公告)号：US20030037857A1

公开(公告)日：2003-02-27

申请号：US09940291

申请日：2001-08-27

申请人： Motorola, Inc.

发明人： Jeremy W. Burdon ,  Rong Fong Huang

IPC分类号： C03B029/00

CPC分类号： C04B35/10 ,  B32B18/00 ,  B32B37/04 ,  B32B2309/022 ,  C04B35/632 ,  C04B35/63444 ,  C04B35/638 ,  C04B35/645 ,  C04B35/653 ,  C04B2235/36 ,  C04B2235/656 ,  C04B2235/9615 ,  C04B2237/343 ,  C04B2237/525 ,  C04B2237/62

摘要： An intermediate low-pressure laminated ceramic device is formed from a plurality of layers of unfired ceramic material each including ceramic particles in an organic binder. A polymer interfacial layer having a glass transition temperature such that it flows at a temperature below a temperature required for the unfired ceramic layers to substantially deform, is deposited on one surface of each of the unfired ceramic layers. The unfired ceramic layers are stacked with an interfacial layer positioned between adjacent unfired ceramic layers in the stack. The stack is heated to a temperature greater than the glass transition temperature of the interfacial layers and a pressure is applied to the heated stack below approximately 1200 psi to fixedly bond the plurality of layers in the stack together.