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3 条记录 (耗时 0.022 秒)

    Antenna
    1.
    外观设计
    Antenna 有权

    公开(公告)号：USD1028951S1

    公开(公告)日：2024-05-28

    申请号：US29822520

    申请日：2022-01-10

    申请人： Mitsubishi Electric Corporation

    设计人： Kei Yokokawa ,  Narihiro Nakamoto ,  Toru Fukasawa ,  Hitoshi Arai ,  Tomohiro Takahashi ,  Kensuke Iwaki ,  Takamichi Kono ,  Keisuke Fujiwara ,  Kenjiro Takanishi ,  Tatsuya Sakamoto ,  Naoya Noguchi

    摘要： FIG. 1 is a perspective view of an antenna showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a top plan view thereof; a bottom view being a minor image;
    FIG. 5 is a right side view thereof; a left side view being a minor image;
    FIG. 6 is an enlarged view of 6-6 part shown in FIG. 2 thereof;
    FIG. 7 is an enlarged view of 7-7 part shown in FIG. 3 thereof;
    FIG. 8 is an end view of cutting part at 8-8 of FIG. 6 thereof; and,
    FIG. 9 is an enlarged view of 9-9 part shown in FIG. 8 thereof.
    The broken lines shown represent portions of the antenna and form no part of the claimed design.
    The dot-dash broken lines illustrate a boundary of the claimed design and form no part of the claimed design.

    Composite printed wiring board and method of manufacturing the same
    2.
    发明授权
    Composite printed wiring board and method of manufacturing the same 有权

    公开(公告)号：US11785718B2

    公开(公告)日：2023-10-10

    申请号：US17429353

    申请日：2020-03-26

    申请人： Mitsubishi Electric Corporation

    发明人： Takamichi Kono ,  Hitoshi Arai ,  Tatsuya Sakamoto

    IPC分类号： H05K1/14 ,  H05K3/36 ,  H05K3/46

    CPC分类号： H05K1/144 ,  H05K3/368 ,  H05K3/4644 ,  H05K2201/042

    摘要： A composite printed wiring board that allows for reflow heating for mounting electronic components using solder includes a first printed wiring board, an intermediate member, a second printed wiring board, and a bonding layer. The intermediate member is stacked on the first printed wiring board. The intermediate member has a cavity. The second printed wiring board is stacked on a surface on the opposite side to a surface opposed to the first printed wiring board in the intermediate member. The bonding layer is arranged at a bonding section between the first printed wiring board and the intermediate member and at a bonding section between the second printed wiring board and the intermediate member. The bonding layer contains high melting point metal and low melting point metal. The melting point of the bonding layer is higher than the melting point of the low melting point metal.