- 专利标题： Antenna manufacturing method and antenna device
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申请号： US17615840申请日： 2019-06-24
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公开(公告)号： US11621482B2公开(公告)日： 2023-04-04
- 发明人: Kei Yokokawa , Narihiro Nakamoto , Toru Fukasawa , Hitoshi Arai , Tomohiro Takahashi , Kensuke Iwaki , Takamichi Kono , Keisuke Fujiwara
- 申请人： Mitsubishi Electric Corporation
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Electric Corporation
- 当前专利权人： Mitsubishi Electric Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Xsensus LLP
- 国际申请： PCT/JP2019/024949 WO 20190624
- 国际公布： WO2020/261332 WO 20201230
- 主分类号： H01Q1/42
- IPC分类号： H01Q1/42 ; H01Q9/04 ; H01Q21/00 ; H01Q21/06
摘要：
A conductor ground plane provided on a dielectric substrate and provided with a patch antenna and a conductor ground plane provided on the side of a dielectric substrate having a through hole are bonded by solder in a state where the through hole and the patch antenna are arranged to face each other, and a conductor ground plane provided on the back side of the dielectric substrate and a conductor ground plane provided on a dielectric substrate are bonded by solder.
公开/授权文献
- US20220209402A1 ANTENNA MANUFACTURING METHOD AND ANTENNA DEVICE 公开/授权日：2022-06-30
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