公开(公告)号：US20170294369A1

公开(公告)日：2017-10-12

申请号：US15508118

申请日：2014-11-07

申请人： Mitsubishi Electric Corporation

发明人： Hiroshi KAWASHIMA ,  Ken SAKAMOTO ,  Satoshi KONDO ,  Taketoshi SHIKANO ,  Yoshihiro TAKAI ,  Claudio FELICIANI

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L23/49537 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A power semiconductor device includes a power semiconductor element, a controlling element, a first lead frame and a second lead frame, respectively, a first metal wire electrically connecting the power semiconductor element and the first lead frame, and a sealing body covering these components. The first lead frame includes a first inner lead having a connecting surface to which one end of the first metal wire is connected. Among surfaces of the sealing body, in a side surface, a resin inlet mark is formed in a side surface portion from which the first lead frame and the second lead frame do not project, the resin inlet mark being greater in surface roughness than another area. The resin inlet mark is formed opposite to a side where the first metal wire is positioned on the connecting surface when seen in the direction along the mounting surface.