公开(公告)号：US20140217156A1

公开(公告)日：2014-08-07

申请号：US14250546

申请日：2014-04-11

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Aya MUTO ,  Masayoshi Shinkai

IPC: H01L23/00

CPC classification number: H01L24/27 ,  B23K1/0016 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16245 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/2747 ,  H01L2224/29019 ,  H01L2224/291 ,  H01L2224/29561 ,  H01L2224/2957 ,  H01L2224/296 ,  H01L2224/32245 ,  H01L2224/33151 ,  H01L2224/33181 ,  H01L2224/811 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83104 ,  H01L2224/83141 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83385 ,  H01L2224/83815 ,  H01L2224/83951 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.

Abstract translation: 提供一种接合方法，其允许在多个部分同时进行接合处理，而不受对接合材料的供应时间限制的影响，并且提供使用该接合方法的半导体器件制造方法。 暂时组装了芯片和引线框架，其间插入有固体焊料块。 焊块设有沿一个方向突出的突出部分。 突出部分插入引线框架的焊料供给口，由此临时组装芯片和引线框架。 随后，芯片和引线框架被馈送到回流炉中，并且焊料块熔化并随后固化。 因此，芯片和引线框架彼此连接。

公开(公告)号：US20240304567A1

公开(公告)日：2024-09-12

申请号：US18538889

申请日：2023-12-13

Applicant: Mitsubishi Electric Corporation

Inventor： Aya MUTO ,  Fumihito KAWAHARA

IPC: H01L23/00 ,  H01L21/52 ,  H01L21/56 ,  H01L23/053 ,  H01L23/16 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/52 ,  H01L21/56 ,  H01L23/053 ,  H01L23/16 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/83 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2224/73265 ,  H01L2224/83801

Abstract: A semiconductor device includes a semiconductor element, a case, a beam, and a sealing insulating material. The semiconductor element is mounted on a base plate. The case has a frame shape in plan view. The case is attached to the base plate. The case houses the semiconductor element inside the frame shape. The beam has a flat plate shape. The beam is held by the case. The beam is held over an internal space that is a space inside the frame shape of the case. The sealing insulating material fills the internal space of the case and covers at least a part of the beam. The beam is provided above the semiconductor element and covers the semiconductor element in plan view.