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公开(公告)号:US08817534B2
公开(公告)日:2014-08-26
申请号:US13899177
申请日:2013-05-21
IPC分类号: G11C16/04 , G11C11/24 , H01L29/788
CPC分类号: H01L27/10844 , G11C11/39 , G11C11/403 , G11C11/404 , G11C16/10 , G11C2211/4016 , H01L21/76831 , H01L21/76877 , H01L21/823475 , H01L27/1023 , H01L27/108 , H01L27/10802 , H01L29/66477 , H01L29/7841
摘要: Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus including a first region and a second region. The apparatus may also include a body region disposed between the first region and the second region and capacitively coupled to a plurality of word lines, wherein each of the plurality of word lines is capacitively coupled to different portions of the body region.
摘要翻译: 公开了一种用于提供半导体存储器件的技术。 在一个特定的示例性实施例中,可以将技术实现为包括第一区域和第二区域的装置。 该装置还可以包括设置在第一区域和第二区域之间并且电容耦合到多个字线的主体区域,其中多个字线中的每一个电容耦合到身体区域的不同部分。