公开(公告)号：US20250140713A1

公开(公告)日：2025-05-01

申请号：US18673383

申请日：2024-05-24

Applicant: Microchip Technology Incorporated

Inventor： Shesh Mani Pandey ,  Randy L. Yach ,  Bruce Odekirk ,  George Dorman ,  Gary Frazier

IPC: H01L23/00 ,  H01L23/31 ,  H01L29/06

Abstract: A moisture resistant semiconductor device may include a substrate and a plurality of terminations in the substrate of the semiconductor device, wherein the plurality of terminations are laterally adjacent to an active region of the semiconductor device. A first insulating layer which overlays the plurality of terminations and the substrate. A trench into the substrate located laterally beyond an edge of the plurality of terminations. A contact layer which overlays the first insulating layer. A second insulating layer which overlays the contact layer. The second insulating layer which overlays the trench. A third insulating layer which overlays the second insulating layer.