公开(公告)号：US11823943B2

公开(公告)日：2023-11-21

申请号：US17739937

申请日：2022-05-09

申请人： Memjet Technology Limited

发明人： Nicolas Arnal ,  Troy Pasiola Quimpo ,  Angus North

IPC分类号： H01L21/683

CPC分类号： H01L21/6836

摘要： A wafer assembly for use in a MEMS fabrication process. The wafer package includes: a MEMS wafer having a first side and an opposite second side; a silicone-free peel tape releasably attached to the first side of the wafer; a wafer bonding tape attached to the peel tape; and a carrier substrate releasably attached to the first wafer bonding tape.

公开(公告)号：US20200381284A1

公开(公告)日：2020-12-03

申请号：US16889734

申请日：2020-06-01

申请人： MEMJET TECHNOLOGY LIMITED

发明人： Nicolas Arnal ,  Troy Pasiola Quimpo ,  Angus North

IPC分类号： H01L21/683

摘要： A process for handling MEMS wafers includes the steps of: (i) attaching a first carrier substrate to a first side of a MEMS wafer, the first carrier substrate being attached via a first wafer bonding tape and a silicone-free peel tape, the peel tape contacting the first side of the MEMS wafer; (ii) performing wafer processing steps on an opposite second side of the MEMS wafer; (iii) releasing the first carrier substrate from the first side of the MEMS wafer via exposure to an energy source, the energy source selectively releasing the wafer bonding tape from the first side of the MEMS wafer; and (iv) peeling the peel tape away from the first side of the MEMS wafer.

公开(公告)号：US11355383B2

公开(公告)日：2022-06-07

申请号：US16889734

申请日：2020-06-01

申请人： MEMJET TECHNOLOGY LIMITED

发明人： Nicolas Arnal ,  Troy Pasiola Quimpo ,  Angus North

IPC分类号： H01L21/30 ,  H01L21/46 ,  H01L21/78 ,  B32B7/12 ,  H01L21/683

摘要： A process for handling MEMS wafers includes the steps of: (i) attaching a first carrier substrate to a first side of a MEMS wafer, the first carrier substrate being attached via a first wafer bonding tape and a silicone-free peel tape, the peel tape contacting the first side of the MEMS wafer; (ii) performing wafer processing steps on an opposite second side of the MEMS wafer; (iii) releasing the first carrier substrate from the first side of the MEMS wafer via exposure to an energy source, the energy source selectively releasing the wafer bonding tape from the first side of the MEMS wafer; and (iv) peeling the peel tape away from the first side of the MEMS wafer.