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公开(公告)号：US20220187135A1
公开(公告)日：2022-06-16
申请号：US17512776
申请日：2021-10-28
Applicant: Melexis Technologies NV
Inventor： Jos RENNIES , Wouter REUSEN , Luc BUYDENS
Abstract: A thermal imaging apparatus comprising: a thermal detector device (100) comprising an array of thermal sensing pixels (102) and signal processing circuitry (104) coupled to the detector device (100). The circuitry (104) supports a background identifier (110) and a pixel classifier (112), the background identifier (110) comprising a common intensity identifier (114) and an expected background intensity calculator (116). The background identifier (110) receives pixel measurement data captured by the detector device (100) in respect of pixels of the array (102) and the common intensity identifier (114) identifies a largest number of substantially the same pixel intensity values from the pixel measurement data. The expected background intensity calculator (116) uses the largest number of substantially the same pixel intensity values to generate a model of expected background intensity levels. The pixel classifier (112) uses the model to determine whether an intensity measurement by a pixel (118) of the array (102) corresponds to a background or an object in an image.
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公开(公告)号：US20160149105A1
公开(公告)日：2016-05-26
申请号：US14951554
申请日：2015-11-25
Applicant: Melexis Technologies NV
Inventor： Carl VAN BUGGENHOUT , Appolonius Jacobus VAN DER WIEL , Luc BUYDENS
IPC: H01L35/28 , H01L35/34 , H01L27/144 , H01L31/09
CPC classification number: H01L35/28 , B81B7/02 , B81B2201/0207 , B81B2203/0315 , G01J1/0214 , G01J1/0295 , G01J1/4228 , G01J5/0225 , G01J5/024 , G01J5/0285 , G01J5/045 , G01J5/06 , G01J5/0803 , G01J5/12 , G01J2005/068 , H01L27/144 , H01L27/1443 , H01L31/0203 , H01L31/02164 , H01L31/09 , H01L35/34
Abstract: A chip for radiation measurements, the chip comprising a first substrate comprising a first sensor and a second sensor. The chip moreover comprises a second substrate comprising a first cavity and a second cavity both with oblique walls. An internal layer is present on the inside of the second cavity. The second substrate is sealed to the first substrate with the cavities on the inside such that the first cavity is above the first sensor and the second cavity is above the second sensor.
Abstract translation: 一种用于辐射测量的芯片，该芯片包括包括第一传感器和第二传感器的第一基板。 该芯片还包括第二基板，其包括具有倾斜壁的第一腔和第二腔。 内层存在于第二腔的内侧。 第二基板被密封到第一基板上，在内部具有空腔，使得第一腔在第一传感器之上，第二腔位于第二传感器之上。
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公开(公告)号：US20180106681A1
公开(公告)日：2018-04-19
申请号：US15785779
申请日：2017-10-17
Applicant: Melexis Technologies NV
Inventor： Luc BUYDENS
Abstract: An electronic device for measuring an ambient temperature (Tair) of the environment of an electronic device is described. It comprises at least one integrated infrared sensor, a blinded window preventing infrared radiation to directly impinge on the integrated infrared sensor and being in thermal contact with the environment as well as with a cover of the device resulting in the blinded window being at a surface temperature (Tsurface). The at least one integrated infrared sensor is adapted for sensing the temperature of the blinded window (Tsurface). The device also comprises at least one absolute temperature sensor for measuring a temperature of the at least one infrared sensor (Tsensor) itself, and a processing means for determining a temperature difference (ΔT) between the sensed surface temperature (Tsurface) and the temperature of the infrared sensor (Tsensor) and for calculating based thereon the ambient temperature (Tair).
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公开(公告)号：US20150136985A1
公开(公告)日：2015-05-21
申请号：US14542745
申请日：2014-11-17
Applicant: Melexis Technologies NV
Inventor： Luc BUYDENS
IPC: H01L31/0232 , H01L31/0352 , G01J5/02
CPC classification number: H01L31/0232 , G01J1/0214 , G01J1/06 , G01J5/0265 , G01J5/06 , G01J5/0831 , G01J5/089 , H01L31/02325 , H01L31/0352
Abstract: A semiconductor device comprising an infrared sensor assembly for sensing infrared radiation is described. The infrared sensor assembly comprises a single sensing element for sensing infrared radiation and an aperture means comprising a plurality of apertures. The sensing element and the aperture means thereby are positioned with respect to each other so that the plurality of apertures are positioned in front of the same, single sensing element so that the plurality of apertures limit the field of view of the same, single sensing element for impinging radiation.
Abstract translation: 描述了包括用于感测红外辐射的红外传感器组件的半导体器件。 红外传感器组件包括用于感测红外辐射的单个感测元件和包括多个孔的孔装置。 因此，感测元件和孔装置相对于彼此定位，使得多个孔定位在相同的单个感测元件的前面，使得多个孔限制相同的单个感测元件的视场 用于冲击辐射。
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公开(公告)号：US20240297260A1
公开(公告)日：2024-09-05
申请号：US18534074
申请日：2023-12-08
Applicant: Melexis Technologies NV
Inventor： Rachel GLEESON , Luc BUYDENS
IPC: H01L31/0203 , H01L23/26 , H01L31/18
CPC classification number: H01L31/0203 , H01L23/26 , H01L31/18
Abstract: A method of manufacturing a sensor device (100) comprises forming (200) a substrate (102) comprising a sensor element followed by forming (202) a cap layer (104). The cap layer (104) is then bonded (204) to the substrate (102) before the substrate (102) is thinned (206). A via is formed (210) between the sensor element and a back side of the thinned substrate (102). An electrical connection is provided between the sensor element and the back side of the thinned substrate (102). A mask is formed (208) on the cap layer (104) to define an area about a predetermined window region (108) before forming (210) of the via. A portion of the cap layer (104) about the predetermined window region (108) of the cap layer (104) is removed (212) after formation (210) of the via.
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Patent Agency Ranking
公开(公告)号：US20230177656A1
公开(公告)日：2023-06-08
申请号：US17984387
申请日：2022-11-10
Applicant: Melexis Technologies NV
Inventor： Wouter REUSEN , Luc BUYDENS
CPC classification number: G06T5/003 , G06T5/20 , G06T7/168 , G06T2207/10048 , G06T2207/20021 , G06T2207/20056 , G06T2207/20201
Abstract: A method of generating a de-interlacing filter comprises: analysing a pixel array comprising an interlacing pattern of pixels. The interlacing pattern of pixels comprises first and second pluralities of pixels configured to be read during a first measurement subframe and a second measurement subframe, respectively. An n-state representation of the interlacing pattern of pixels is generated and distinguishes between the first plurality of pixels and the second plurality of pixels. The n-state representation of the interlacing pattern is translated to a spatial frequency domain, thereby generating a spatial frequency domain representation of the n-state representation of the interlacing pattern. A DC signal component is then removed from the spatial frequency domain representation of the n-state representation of the interlacing pattern, thereby generating a DC-less spatial frequency domain representation. A kernel filter is then selected and configured to blur before convolving the DC-less spatial frequency representation with the selected kernel filter.
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公开(公告)号：US20150369669A1
公开(公告)日：2015-12-24
申请号：US14744410
申请日：2015-06-19
Applicant: MELEXIS TECHNOLOGIES NV
Inventor： Viktor KASSOVSKI , Luc BUYDENS , Sam MADDALENA
CPC classification number: G01J5/12 , G01J5/0803 , G01J5/16 , G01J2005/0048 , G01J2005/066
Abstract: An infrared sensor for temperature sensing comprises a cap covering a substrate; an IR-radiation filtering window in the cap transparent to IR radiation; a first sensing element comprising a set of N thermocouples on the substrate covered by the cap, whose hot junctions may receive radiation; a second sensing element comprising a set of N thermocouples on the substrate covered by the cap whose hot junctions may not receive radiation; first connection modules for connecting a number N1 of thermocouples of the first sensing element, second connection modules for connecting a number N2 of thermocouples of the second sensing; connecting means for connecting an output of the first connection modules of the first sensing element with an output of the second connection modules of the second sensing element, and an output of the combined outputs of the sensing elements.
Abstract translation: 用于温度感测的红外传感器包括覆盖基板的盖子; IR辐射中的IR辐射过滤窗对IR辐射透明; 第一感测元件包括在由帽盖覆盖的衬底上的一组N个热电偶，其热接点可以接收辐射; 第二感测元件，包括一组N个热电偶，所述N个热电偶在所述基板上被所述盖子覆盖，所述盖子的热接头可能不接收辐射; 用于连接第一感测元件的N1个热电偶的第一连接模块，用于连接第二感测的热电偶的数量N2的第二连接模块; 连接装置，用于将第一感测元件的第一连接模块的输出与第二感测元件的第二连接模块的输出连接，以及感测元件的组合输出的输出。
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公开(公告)号：US20230333014A1
公开(公告)日：2023-10-19
申请号：US18182010
申请日：2023-03-10
Applicant: Melexis Technologies NV
Inventor： Jos RENNIES , Luc BUYDENS
IPC: G01N21/55
CPC classification number: G01N21/55 , G01N2201/123 , G01N2201/12746
Abstract: In a heating appliance comprising a substrate for receiving an item of cookware, a method of measuring reflectivity comprises emitting a time-varying electromagnetic signal from a first side of the substrate, a portion of the time-varying electromagnetic signal propagating through the substrate. Electromagnetic radiation is then received at the first side of the substrate, the received electromagnetic radiation comprising a background ambient component received and a component reflected by the substrate. A gain factor is applied to translate the received electromagnetic radiation to a receive electrical signal. An offset signal component is then identified from the receive electrical signal, the offset signal component arising from the background ambient component of the received electromagnetic radiation. The gain factor from the offset signal component is then estimated using a characterisation of the offset signal component, and the reflectivity is calculated using the receive electrical signal and the estimated gain factor.
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9.发明申请公开(公告)号：US20220405949A1
公开(公告)日：2022-12-22
申请号：US17837448
申请日：2022-06-10
Applicant: Melexis Technologies NV
Inventor： Wouter REUSEN , Luc BUYDENS , Adrian HILL
IPC: G06T7/33
Abstract: A method of digitally processing a plurality of pixels of an image captured using an array of sensing pixels of an optical sensor device. The method comprises identifying a measurement pixel of the plurality of pixels corresponding to a measurement point on a target to be measured. The method then comprises identifying a number of pixels of the plurality of pixels neighbouring the measurement pixel, the number of pixels having a number of intensity values, respectively. A curve is then fitted to the number of pixels and the number of respective intensity values. An estimated intensity value is then determined from the curve in respect of the measurement pixel, thereby simulating a predetermined field of view in respect of the measurement pixel narrower than an actual field of view of the measurement pixel.
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公开(公告)号：US20200378834A1
公开(公告)日：2020-12-03
申请号：US16866698
申请日：2020-05-05
Applicant: Melexis Technologies NV
Abstract: A method of measuring temperature based upon a system of equations applying Stefan-Boltzmann's law and using a measurement value for an object to be measured and an ambient temperature value (Ta) comprises: pre-calculating (200, 202) a first vector (LUT1) and a second vector (LUT2). The first vector (LUT1) is a series of values proportional to received power based upon respective temperature values and in respect of a predetermined generic range of temperatures. The second vector (LUT2) is a series of sensitivity characteristic factor values based upon expected measured temperature values and in respect of a predetermined range of expected object measured temperatures. The first vector (LUT1) and the second vector (LUT2) are used (206) to generate a temporary vector (LUTT) of a series of values limited to the ambient temperature value to solve the system of equations in respect of the measurement value for the object, thereby determining (208) a temperature (To) for the object from the measurement value.
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