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公开(公告)号：US20030138993A1
公开(公告)日：2003-07-24
申请号：US10328189
申请日：2002-12-26
IPC分类号： H01L021/44 , H01L021/48 , H01L021/50
CPC分类号： H01L21/563 , H01L24/29 , H01L24/75 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75743 , H01L2224/83192 , H01L2224/83859 , H01L2224/83874 , H01L2224/83951 , H01L2225/06517 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a semiconductor device whereby semiconductor elements like semiconductor bare chips are mounted with high productivity on both surfaces of a circuit board while preventing the board from warping, and an apparatus for manufacturing a semiconductor device for faithfully embodying the manufacturing method. Semiconductor elements temporarily fixed on both surfaces of a circuit board are heated while being pressurized in directions to be each pressed against the board, whereby adhesive on both surfaces of the board is thermally set simultaneously and bumps on each semiconductor elements are press-bonded to their opposing board electrodes on the board to be electrically connected. Ultraviolet rays are irradiated to a circumference of mixed curing adhesive applied to at least one surface of the circuit board to form an ultraviolet curing part only on the circumference of the adhesive, thereby increasing strength for temporarily fixing the semiconductor elements to the circuit board.
摘要翻译： 一种制造半导体器件的方法，其中半导体元件如半导体裸芯片以高生产率安装在电路板的两个表面上同时防止板翘曲，以及用于制造半导体器件的装置，用于忠实地体现该制造方法。 临时固定在电路板的两个表面上的半导体元件在被压靠在板上的方向被加压的同时被加热，由此在板的两个表面上的粘合剂被同时热定形，并且将每个半导体元件上的凸块压接在它们 板上的相对的电路板电极要电连接。 紫外线照射到施加到电路板的至少一个表面的混合固化粘合剂的周边，以在粘合剂的周围仅形成紫外线固化部分，从而增加将半导体元件临时固定到电路板的强度。
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